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TVP5145PFPG4

Texas Instruments

TVP5145PFPG4 by Texas Instruments

TVP5145PFPG4 by Texas Instruments is a color signal decoder IC with 80 terminals, operating at 3.3V. It features a max temp of 70°C and terminal finish in nickel palladium gold. Ideal for applications requiring CMOS technology, such as video processing systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,326 parts In-Stock

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Digiode

USA . 2,821 parts In-Stock

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Connect4Technologies Inc.

Canada . 198 parts In-Stock

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Sensible Micro Corp

USA . 103 parts In-Stock

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Parana Technologies

USA . 1,323 parts In-Stock

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$2.472

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$2.965

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DigiPath Technology Company

USA . 1,895 parts In-Stock

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$2.721

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$2.504

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ChromeModa Solutions

Germany . 6,596 parts In-Stock

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$2.777

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$2.277

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IDEA Electronic Components Group

UK . 46 parts In-Stock

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$2.777

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$2.499

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One Stop Electronics

USA . 1,496 parts In-Stock

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$15.800

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AZTECH Wire

Italy . 886 parts In-Stock

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$19.157

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Lixinc

USA . 12,493 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,028 parts In-Stock

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Corphita

USA . 3,838 parts In-Stock

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Kepictronics

USA . 1,278 parts In-Stock

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Overview

Experience vivid and lifelike colors with the TVP5145PFPG4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments brings you this color signal converter that is perfect for a wide range of applications. Whether you're in need of exceptional clarity for video surveillance systems or vibrant hues for multimedia displays, this product delivers outstanding performance. With its innovative technology and durable construction, the TVP5145PFPG4 provides unmatched value and benefits to customers looking for top-notch color decoding solutions. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of the product on circuit boards.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with a wide range of electronic devices and systems.

No. of Terminals: 80

Having 80 terminals provides ample connectivity options and flexibility for integration in various applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliability and stability under varying environmental conditions.

Technology: CMOS

Utilizing CMOS technology results in low power consumption and high-speed performance, making the product energy-efficient and reliable.

Maximum Supply Voltage (Vsup): 3.5 V

The 3.5V maximum supply voltage allows for a stable and robust power input for the product to operate efficiently.

Technical Specifications

Color Signal Converters TVP5145PFPG4 attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Color Signal Converters

Maximum Supply Current:

490 mA

Maximum Supply Voltage (Vsup):

3.5 V

Minimum Supply Voltage (Vsup):

3.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TVP5145PFPG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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