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TVP5145PFP

Texas Instruments

TVP5145PFP by Texas Instruments

TVP5145PFP by Texas Instruments is a color signal decoder IC with 80 terminals, operating at 3.3V. It features a max temp of 70°C, GULL WING terminal form, and CMOS technology. Ideal for applications requiring color signal conversion in commercial-grade environments.

Median Price

$12.210

Lifecycle Status

Suppliers In-Stock

22

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1k+

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Avnet

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Rochester

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Verical

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$11.825

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Flip Electronics

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Digiode

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Vyrian

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Component Electronics Inc.

Canada . 5 parts In-Stock

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$12.500

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DigiKey Marketplace

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Digital Electronic Gebert Verwaltungs UG

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LWI Electronics Inc

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Dan-Mar Components

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LIBRA Elektronik GmbH

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Atlantic Semiconductor

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Parana Technologies

USA . 1,898 parts In-Stock

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DigiPath Technology Company

USA . 1,122 parts In-Stock

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IDEA Electronic Components Group

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ChromeModa Solutions

Germany . 330 parts In-Stock

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Corphita

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Perfect Parts

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Metaverse IC Inc.

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GreenTree Electronics

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Overview

Experience vivid and crisp color signals like never before with the TVP5145PFP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their products. The TVP5145PFP is a game-changer in the Color Signal Converters category, offering customers unmatched value and benefits. Whether you're in need of a color signal decoder for your next project or looking to enhance your current system, this product is sure to impress with its advanced technology and versatile applications. Trust Texas Instruments to deliver excellence with the TVP5145PFP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications while keeping the overall weight of the device low.

Surface Mount: YES

Allows for easy and secure mounting on the circuit board, saving space and simplifying the assembly process.

Power Supplies (V): 3.3

Operates on a common voltage, making it compatible with many existing power systems.

No. of Terminals: 80

Provides ample connection points for various inputs and outputs, offering flexibility in system integration.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, ensuring reliable performance in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Color Signal Converters TVP5145PFP attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3V TO 3.6V ANALOG SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Color Signal Converters

Maximum Supply Current:

490 mA

Maximum Supply Voltage (Vsup):

3.5 V

Minimum Supply Voltage (Vsup):

3.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TVP5145PFP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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