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TVP5040PFP

Texas Instruments

TVP5040PFP by Texas Instruments

TVP5040PFP by Texas Instruments is a color signal decoder with 80 terminals in a square flatpack package. Operating temperature range of 0-70°C, supply voltage of 3.1-3.5V, and max current of 260mA make it ideal for commercial applications requiring precise color signal conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,487 parts In-Stock

1+ parts

-

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4,487

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Digiode

USA . 1,425 parts In-Stock

1+ parts

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1,425

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 733 parts In-Stock

1+ parts

$2.427

100+ parts

-

1k+ parts

$2.924

10k+ parts

-

733

$2.427

-

$2.924

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DigiPath Technology Company

USA . 538 parts In-Stock

1+ parts

$2.672

100+ parts

-

1k+ parts

-

10k+ parts

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538

$2.672

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ChromeModa Solutions

Germany . 3,513 parts In-Stock

1+ parts

$2.727

100+ parts

$2.236

1k+ parts

-

10k+ parts

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3,513

$2.727

$2.236

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IDEA Electronic Components Group

UK . 1,256 parts In-Stock

1+ parts

$2.727

100+ parts

-

1k+ parts

$2.454

10k+ parts

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1,256

$2.727

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$2.454

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One Stop Electronics

USA . 738 parts In-Stock

1+ parts

$8.800

100+ parts

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738

$8.800

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AZTECH Wire

Italy . 578 parts In-Stock

1+ parts

$10.355

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578

$10.355

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Corphita

USA . 897 parts In-Stock

1+ parts

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897

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Overview

Unleash the vibrant colors and crisp images with the Texas Instruments TVP5040PFP Color Signal Converter. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This versatile product is perfect for a wide range of applications, offering customers unmatched value and benefits. Experience superior performance and seamless integration with the TVP5040PFP - your gateway to a world of vivid visuals like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the converter.

Surface Mount: YES

Being surface mountable makes it easy to integrate this converter into circuit boards without the need for additional mounting hardware.

General IC Type: COLOR SIGNAL DECODER

The color signal decoder functionality ensures accurate and reliable conversion of color signals, making this converter ideal for color-related applications.

Maximum Operating Temperature: 70 °C

The high operating temperature range allows this converter to function effectively in various environments without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the converter remains operational even in extreme cold conditions.

Width: 12 mm

The compact 12mm width of the converter allows for easy installation in tight spaces or on crowded circuit boards.

Minimum Supply Voltage (Vsup): 3.1 V

The low minimum supply voltage requirement ensures efficient power usage and compatibility with a wide range of power sources.

Technical Specifications

Color Signal Converters TVP5040PFP attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V DIGITAL SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

260 mA

Maximum Supply Voltage (Vsup):

3.5 V

Minimum Supply Voltage (Vsup):

3.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

TVP5040PFP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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