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LC749870LG

Onsemi

LC749870LG by Onsemi

LC749870LG by Onsemi is a color signal decoder IC with 64 terminals in a square grid array package. Operating temperature ranges from -40 °C to 85°C, suitable for industrial applications. It features power supplies of 1.8V and 3.3V, making it ideal for various color signal conversion tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,431 parts In-Stock

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Digiode

USA . 1,134 parts In-Stock

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Problanco Electronics

Mexico . 6,607 parts In-Stock

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TANS Electronics

Latvia . 6,066 parts In-Stock

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SupplyDigital Components

Austria . 4,951 parts In-Stock

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Kulean Microsystems

USA . 3,093 parts In-Stock

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Corphita

USA . 1,990 parts In-Stock

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UHIMA Technologies

Türkiye . 538 parts In-Stock

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Corohmni

South Africa . 102 parts In-Stock

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Overview

Upgrade your color signal decoding experience with the LC749870LG by Onsemi. Crafted with precision and quality, this cutting-edge color signal converter offers unparalleled performance in a compact square package body material. Designed for industrial-grade applications, this innovative IC type provides power supplies of 1.8V and 3.3V, ensuring optimal functionality in a wide range of settings. With 64 terminals and a grid array package style, the LC749870LG promises seamless integration and superior reliability. Say goodbye to compatibility issues and hello to enhanced efficiency with Onsemi's LC749870LG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the color signal converter.

Surface Mount: YES

Being surface mountable enables easy and convenient installation of the color signal converter on circuit boards, saving space and making assembly more efficient.

Power Supplies (V): 1.8,3.3

The availability of multiple power supply options (1.8V and 3.3V) allows flexibility in designing and integrating the color signal converter into various systems with different voltage requirements.

No. of Terminals: 64

With 64 terminals, this color signal converter offers a wide range of connectivity options, making it suitable for complex color decoding applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures that the color signal converter can withstand heat and operate reliably in demanding industrial environments.

Technology: CMOS

Utilizing CMOS technology makes the color signal converter energy-efficient and provides high-speed operation, enhancing overall performance.

Technical Specifications

Color Signal Converters LC749870LG attributes and parameters. Explore more Color Signal Converters devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PBGA-N64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

LGA

Package Equivalence Code:

LGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Sub-Category:

Color Signal Converters

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

LC749870LG General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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