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TUSB3410RHBT

Texas Instruments

TUSB3410RHBT by Texas Instruments

TUSB3410RHBT by Texas Instruments is a 32-terminal bus controller with 3.3V power supply, supporting RS232 and RS485 interfaces. It operates at temperatures from 0 to 70°C, achieving a max data transfer rate of 1.5 MBps. Ideal for USB applications due to its CMOS technology and I2C compatibility.

Median Price

$4.975

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$3.980

1k+ parts

$3.560

10k+ parts

$3.350

750

-

$3.980

$3.560

$3.350

DigiKey

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$5.240

1k+ parts

-

10k+ parts

-

750

-

$5.240

-

-

Verical

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$4.975

1k+ parts

$4.450

10k+ parts

$4.188

750

-

$4.975

$4.450

$4.188

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$4.380

100+ parts

-

1k+ parts

-

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500

$4.380

-

-

-

Digiode

USA . 2,811 parts In-Stock

1+ parts

$4.664

100+ parts

-

1k+ parts

-

10k+ parts

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2,811

$4.664

-

-

-

Vyrian

USA . 3,371 parts In-Stock

1+ parts

-

100+ parts

-

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3,371

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-

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Cyclops Electronics Ltd

UK . 157 parts In-Stock

1+ parts

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157

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 615 parts In-Stock

1+ parts

$4.170

100+ parts

-

1k+ parts

-

10k+ parts

-

615

$4.170

-

-

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Corohmni

South Africa . 5,213 parts In-Stock

1+ parts

$4.342

100+ parts

-

1k+ parts

-

10k+ parts

-

5,213

$4.342

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

$4.380

100+ parts

-

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-

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-

50

$4.380

-

-

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Corphita

USA . 456 parts In-Stock

1+ parts

$4.419

100+ parts

-

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-

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456

$4.419

-

-

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Parana Technologies

USA . 1,829 parts In-Stock

1+ parts

$16.285

100+ parts

-

1k+ parts

$16.594

10k+ parts

-

1,829

$16.285

-

$16.594

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ChromeModa Solutions

Germany . 6,935 parts In-Stock

1+ parts

$18.298

100+ parts

$15.004

1k+ parts

-

10k+ parts

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6,935

$18.298

$15.004

-

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IDEA Electronic Components Group

UK . 1,390 parts In-Stock

1+ parts

$18.298

100+ parts

$17.383

1k+ parts

$16.468

10k+ parts

-

1,390

$18.298

$17.383

$16.468

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QUARKTWIN TECHNOLOGY LTD

USA . 3,925 parts In-Stock

1+ parts

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100+ parts

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3,925

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Perfect Parts

USA . 1,637 parts In-Stock

1+ parts

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1,637

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DigiPath Technology Company

USA . 413 parts In-Stock

1+ parts

-

100+ parts

$16.497

1k+ parts

-

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413

-

$16.497

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Microchip USA

USA . 371 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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371

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Overview

Unlock seamless connectivity with the TUSB3410RHBT by Texas Instruments, a top-tier manufacturer known for delivering high-quality bus controllers. This versatile chip carrier boasts a very thin profile, providing maximum performance in a compact package. Ideal for applications requiring fast data transfer rates of up to 1.5 MBps, this USB controller offers unparalleled reliability and efficiency. Say goodbye to connectivity issues and hello to a world of possibilities with the TUSB3410RHBT - your gateway to seamless communication.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

Package Shape: SQUARE

Enables efficient use of space on the circuit board, maximizing the number of components that can be placed.

Power Supplies (V): 3.3

Operates at a commonly used voltage level, ensuring compatibility with other components in the system.

No. of Terminals: 32

Provides ample connectivity options for interfacing with other devices and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers a range of package styles to suit different mounting and cooling needs, enhancing flexibility in design.

Minimum Supply Voltage: 3 V

Allows for operation at a lower supply voltage if needed, conserving power and reducing energy consumption.

Maximum Operating Temperature: 70 °C

Ensures reliable performance in various environmental conditions, including elevated temperatures.

Maximum Data Transfer Rate: 1.5 MBps

Supports high-speed data transfer, enabling quick and efficient communication between devices.

Minimum Operating Temperature: 0 °C

Operates effectively even in low-temperature environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides a reliable and corrosion-resistant finish for the terminals, ensuring a stable electrical connection.

Terminal Position: QUAD

Facilitates easy soldering and connection to the circuit board, simplifying the assembly process.

Maximum Seated Height: 1 mm

Has a low profile design, saving space in compact electronic devices.

Width: 5 mm

Compact dimensions make it suitable for integration into small form-factor applications.

Maximum Clock Frequency: 12 MHz

Supports high-speed clock frequencies for efficient data processing and communication.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient time during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability during assembly.

Length: 5 mm

Compact length contributes to the overall small footprint of the product, ideal for space-constrained applications.

Temperature Grade: COMMERCIAL

Suitable for use in standard commercial environments, meeting industry standards for operation.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Supports bus control functions and interfaces with universal serial bus peripherals, enhancing connectivity capabilities.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, improving overall efficiency.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations and ensure safe handling during manufacturing and disposal.

Maximum Supply Current: 15 mA

Requires low supply current for operation, minimizing power consumption and heat dissipation.

Nominal Supply Voltage: 3.3 V

Stable supply voltage ensures consistent performance and compatibility with other components.

Bus Compatibility: I2C

Supports I2C bus communication protocol, enabling seamless integration with I2C compatible devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact packaging and efficient signal routing on the circuit board.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates a moderate sensitivity to moisture, suitable for standard assembly and storage conditions.

Drive Interface Standard: RS232; RS485

Supports RS232 and RS485 drive interfaces, offering flexibility and compatibility with various communication standards.

Technical Specifications

Bus Controllers TUSB3410RHBT attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

0

Bus Compatibility:

I2C

Maximum Clock Frequency:

12 MHz

Maximum Data Transfer Rate:

1.5 MBps

Drive Interface Standard:

RS232; RS485

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TUSB3410RHBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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