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TUSB217RGYRQ1

Texas Instruments

TUSB217RGYRQ1 by Texas Instruments

TUSB217RGYRQ1 by Texas Instruments is a USB bus controller with 14 terminals, operating voltage range of 2.3V to 6.5V, and data transfer rate up to 60MBps. Ideal for industrial applications requiring I2C bus compatibility and CMOS technology in a compact chip carrier package.

Median Price

$5.134

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,694 parts In-Stock

1+ parts

$5.134

100+ parts

$4.185

1k+ parts

$2.790

10k+ parts

-

4,694

$5.134

$4.185

$2.790

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 820 parts In-Stock

1+ parts

$4.877

100+ parts

-

1k+ parts

-

10k+ parts

-

820

$4.877

-

-

-

Chip Stock

USA . 17,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,390

-

-

-

-

Bristol Electronics

USA . 8,999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,999

-

-

-

-

Vyrian

USA . 7,404 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,404

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,454 parts In-Stock

1+ parts

$4.621

100+ parts

-

1k+ parts

-

10k+ parts

-

2,454

$4.621

-

-

-

AZTECH Wire

Italy . 870 parts In-Stock

1+ parts

$21.560

100+ parts

-

1k+ parts

-

10k+ parts

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870

$21.560

-

-

-

Parana Technologies

USA . 241 parts In-Stock

1+ parts

$66.473

100+ parts

-

1k+ parts

-

10k+ parts

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241

$66.473

-

-

-

Corohmni

South Africa . 3,179 parts In-Stock

1+ parts

$68.089

100+ parts

-

1k+ parts

-

10k+ parts

-

3,179

$68.089

-

-

-

DigiPath Technology Company

USA . 1,750 parts In-Stock

1+ parts

$73.195

100+ parts

$67.340

1k+ parts

-

10k+ parts

-

1,750

$73.195

$67.340

-

-

ChromeModa Solutions

Germany . 2,540 parts In-Stock

1+ parts

$74.689

100+ parts

$61.245

1k+ parts

-

10k+ parts

-

2,540

$74.689

$61.245

-

-

IDEA Electronic Components Group

UK . 997 parts In-Stock

1+ parts

$74.689

100+ parts

$70.955

1k+ parts

$67.220

10k+ parts

-

997

$74.689

$70.955

$67.220

-

Futuretech Components

Singapore . 11,921 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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11,921

-

-

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Lixinc

USA . 9,867 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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9,867

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-

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A-Z Elektronik GmbH

Germany . 4,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,500

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Overview

Unlock the power of seamless data transfer with the TUSB217RGYRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The TUSB217RGYRQ1 falls under the category of Bus Controllers, making it an essential component for various applications. With a maximum data transfer rate of 60 MBps and a wide operating temperature range, this chip carrier offers unparalleled performance and versatility. Trust Texas Instruments to deliver cutting-edge technology for your USB needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on PCBs, saving time and space in the overall design.

Maximum Supply Voltage: 6.5 V

The high maximum supply voltage of 6.5 V ensures compatibility with a wide range of power sources, making it versatile in different setups.

Screening Level: AEC-Q100

AEC-Q100 screening level signifies that the product meets stringent automotive quality standards, ensuring reliability and performance in automotive applications.

Package Shape: SQUARE

The square package shape provides a compact form factor, saving space on the PCB while also making it easier to mount and integrate into designs.

No. of Terminals: 14

Having 14 terminals allows for multiple connections and interfaces, enabling the product to support various functions and communication channels.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style featuring a chip carrier, heat sink/slug, and very thin profile helps in heat dissipation, compact design, and efficient PCB layout, respectively.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage of 2.3 V makes the product energy-efficient and suitable for low-power applications or scenarios with limited power sources.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, the product can function reliably in high-temperature environments without overheating or performance degradation.

Maximum Data Transfer Rate: 60 MBps

The high maximum data transfer rate of 60 MBps ensures fast and efficient communication and data exchange, making the product suitable for high-speed applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function in extremely cold environments without issues, providing reliability in harsh conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers good solderability and corrosion resistance, enhancing the product's durability and longevity in various operating conditions.

Terminal Position: QUAD

The quad terminal position provides multiple connection points, enabling efficient signal routing and connectivity for improved performance and functionality.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm allows for a compact and slim profile, making the product suitable for applications where space is limited.

Width: 3.5 mm

With a width of 3.5 mm, the product offers a small footprint on the PCB, allowing for dense integration and efficient use of board space.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand a peak reflow temperature for up to 30 seconds, ensuring proper soldering during assembly without compromising its performance or reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and bonding of the product during assembly, contributing to its overall durability and stability.

Length: 3.5 mm

With a length of 3.5 mm, the product maintains a balanced form factor with the width, enabling efficient placement and layout on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies that the product can operate reliably in a wide range of temperature conditions typically encountered in industrial environments.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

The product being a bus controller for universal serial bus (USB) peripherals ensures compatibility and seamless integration with a variety of USB devices, expanding its utility.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the product's performance and efficiency.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead-related issues, such as solder joint failures or environmental concerns, ensuring a safer and more reliable product.

Maximum Supply Current: 0.036 mA

The low maximum supply current of 0.036 mA indicates high efficiency and low power consumption, making the product suitable for battery-operated or energy-conscious applications.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5 V allows for easy compatibility with standard power sources and ensures stable operation within the specified voltage range.

Bus Compatibility: I2C

Compatibility with the I2C bus protocol enables the product to communicate with a wide range of I2C-compatible devices, facilitating seamless data transfer and control.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting and fine-pitch connections, contributing to compact designs and efficient PCB layouts.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 indicates that the product is moderately sensitive to moisture, requiring appropriate handling and storage to maintain its performance and reliability.

Technical Specifications

Bus Controllers TUSB217RGYRQ1 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

0

Bus Compatibility:

I2C

Maximum Data Transfer Rate:

60 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N14

JESD-609 Code:

e3

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

14

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

.036 mA

Maximum Supply Voltage:

6.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

TUSB217RGYRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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