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TUSB215QRGYRQ1

Texas Instruments

TUSB215QRGYRQ1 by Texas Instruments

TUSB215QRGYRQ1 by Texas Instruments is a USB bus controller with 5.5V max supply voltage, 60.03 MBps data transfer rate, and -40 to 105°C operating temperature range. Ideal for industrial applications requiring I2C bus compatibility and CMOS technology for reliable performance in harsh environments.

Median Price

$4.319

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 35,495 parts In-Stock

1+ parts

$4.319

100+ parts

$3.784

1k+ parts

$2.138

10k+ parts

-

35,495

$4.319

$3.784

$2.138

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 968 parts In-Stock

1+ parts

$4.103

100+ parts

-

1k+ parts

-

10k+ parts

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968

$4.103

-

-

-

Vyrian

USA . 5,397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,397

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,091 parts In-Stock

1+ parts

$3.887

100+ parts

-

1k+ parts

-

10k+ parts

-

4,091

$3.887

-

-

-

AZTECH Wire

Italy . 174 parts In-Stock

1+ parts

$14.130

100+ parts

-

1k+ parts

-

10k+ parts

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174

$14.130

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-

-

Parana Technologies

USA . 236 parts In-Stock

1+ parts

$32.031

100+ parts

-

1k+ parts

$94.688

10k+ parts

-

236

$32.031

-

$94.688

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DigiPath Technology Company

USA . 2,266 parts In-Stock

1+ parts

$35.270

100+ parts

-

1k+ parts

-

10k+ parts

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2,266

$35.270

-

-

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ChromeModa Solutions

Germany . 1,901 parts In-Stock

1+ parts

$35.990

100+ parts

$29.512

1k+ parts

-

10k+ parts

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1,901

$35.990

$29.512

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IDEA Electronic Components Group

UK . 433 parts In-Stock

1+ parts

$35.990

100+ parts

$34.190

1k+ parts

$32.391

10k+ parts

-

433

$35.990

$34.190

$32.391

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Corohmni

South Africa . 2,700 parts In-Stock

1+ parts

$65.846

100+ parts

-

1k+ parts

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2,700

$65.846

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Lixinc

USA . 14,314 parts In-Stock

1+ parts

-

100+ parts

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14,314

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

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Overview

Looking for a reliable and efficient solution for your bus control needs? Look no further than the TUSB215QRGYRQ1 by Texas Instruments. With a reputation for high-quality products and cutting-edge technology, Texas Instruments delivers top-of-the-line bus controllers that are perfect for a wide range of applications. From automotive to industrial, this versatile chip carrier offers a maximum data transfer rate of 60.03 MBps and a wide temperature operating range from -40 to 105°C. Trust Texas Instruments to provide you with the best in bus controller technology for all your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and lightweight, ensuring reliable performance.

Surface Mount: YES

Surface mount capability allows for easy and compact installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Supports a maximum supply voltage of 5.5V, making it compatible with a wide range of systems.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and quality standards for automotive applications.

Package Shape: SQUARE

Square package shape offers efficient use of space in the design layout.

No. of Terminals: 14

14 terminals provide ample connectivity options for interfacing with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug and very thin profile design enhances thermal performance and space savings.

Minimum Supply Voltage: 4.4 V

Supports a minimum supply voltage of 4.4V, ensuring compatibility with low-power systems.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C allows for reliable operation in harsh environments.

Maximum Data Transfer Rate: 60.03 MBps

High data transfer rate of 60.03 MBps enables fast and efficient communication between devices.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures operation in extreme cold conditions.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish provides a reliable and corrosion-resistant connection.

Terminal Position: QUAD

QUAD terminal position allows for easy mounting and connection.

Maximum Seated Height: 1 mm

Low maximum seated height of 1mm helps in space-constrained applications.

Width: 3.5 mm

Compact width of 3.5mm saves space on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand a peak reflow temperature for up to 30 seconds, ensuring proper soldering and reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C enables efficient soldering during manufacturing.

Length: 3.5 mm

Compact length of 3.5mm saves space on the PCB.

Temperature Grade: INDUSTRIAL

Designed for industrial applications with a wide operating temperature range and durability.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Performs as a bus controller for universal serial bus (USB) devices, enabling versatile connectivity options.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Terminal Form: NO LEAD

NO LEAD terminal form is environmentally friendly and complies with regulations.

Maximum Supply Current: 0.03 mA

Low maximum supply current of 0.03mA helps in power-efficient operation.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V ensures stable and reliable operation.

Bus Compatibility: I2C

Compatible with the I2C bus for easy integration into various systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for compact design and high-density mounting.

Moisture Sensitivity Level (MSL): 2

Moisture Sensitivity Level 2 indicates that the component is able to withstand standard soldering processes without damage.

Technical Specifications

Bus Controllers TUSB215QRGYRQ1 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

0

Bus Compatibility:

I2C

Maximum Data Transfer Rate:

60.03 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N14

JESD-609 Code:

e3

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

14

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

.03 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

TUSB215QRGYRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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