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TUSB213IRGYT

Texas Instruments

TUSB213IRGYT by Texas Instruments

TUSB213IRGYT by Texas Instruments is a BUS CONTROLLER IC with 14 terminals, operating voltage range of 4.4-5.5 V, and data transfer rate up to 60.03 MBps. It is ideal for industrial applications requiring USB bus compatibility and CMOS technology in a compact square package style suitable for surface mount assembly.

Median Price

$3.875

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 17 parts In-Stock

1+ parts

$2.343

100+ parts

-

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17

$2.343

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Texas Instruments

USA . 212,456 parts In-Stock

1+ parts

$3.169

100+ parts

$2.777

1k+ parts

$1.569

10k+ parts

-

212,456

$3.169

$2.777

$1.569

-

Farnell

UK . 106 parts In-Stock

1+ parts

$3.330

100+ parts

$2.330

1k+ parts

-

10k+ parts

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106

$3.330

$2.330

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-

Mouser Electronics

USA . 968 parts In-Stock

1+ parts

$4.420

100+ parts

$2.790

1k+ parts

$2.440

10k+ parts

$2.410

968

$4.420

$2.790

$2.440

$2.410

DigiKey

USA . 661 parts In-Stock

1+ parts

$4.420

100+ parts

$2.786

1k+ parts

-

10k+ parts

-

661

$4.420

$2.786

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-

Element14

Singapore . 106 parts In-Stock

1+ parts

$6.840

100+ parts

$5.030

1k+ parts

$3.620

10k+ parts

$3.440

106

$6.840

$5.030

$3.620

$3.440

Verical

USA . 17 parts In-Stock

1+ parts

-

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17

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,169 parts In-Stock

1+ parts

$2.226

100+ parts

-

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1,169

$2.226

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Vyrian

USA . 8,992 parts In-Stock

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8,992

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,912 parts In-Stock

1+ parts

$2.109

100+ parts

-

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2,912

$2.109

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Continental Prestige Electronics

USA . 106 parts In-Stock

1+ parts

$3.330

100+ parts

$2.330

1k+ parts

-

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106

$3.330

$2.330

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Microchip USA

USA . 4,370 parts In-Stock

1+ parts

$19.433

100+ parts

-

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4,370

$19.433

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Parana Technologies

USA . 1,692 parts In-Stock

1+ parts

$23.740

100+ parts

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1k+ parts

$24.369

10k+ parts

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1,692

$23.740

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$24.369

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ChromeModa Solutions

Germany . 3,210 parts In-Stock

1+ parts

$26.674

100+ parts

$21.873

1k+ parts

-

10k+ parts

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3,210

$26.674

$21.873

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IDEA Electronic Components Group

UK . 1,279 parts In-Stock

1+ parts

$26.674

100+ parts

$25.340

1k+ parts

$24.007

10k+ parts

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1,279

$26.674

$25.340

$24.007

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Corohmni

South Africa . 4,960 parts In-Stock

1+ parts

$40.520

100+ parts

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4,960

$40.520

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DigiPath Technology Company

USA . 1,713 parts In-Stock

1+ parts

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100+ parts

$24.049

1k+ parts

-

10k+ parts

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1,713

-

$24.049

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Overview

Unlock seamless data transfer with the TUSB213IRGYT by Texas Instruments, a top-of-the-line bus controller designed to elevate your connectivity experience. Crafted from high-quality materials and backed by Texas Instruments' renowned expertise, this chip carrier boasts a very thin profile and matte tin finish for optimal performance. Perfect for industrial applications, this USB compatible device offers lightning-fast data transfer rates of up to 60.03 MBps, ensuring that your devices stay connected and efficient at all times. Upgrade your technology with the TUSB213IRGYT and experience the difference in quality and speed today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while ensuring longevity.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Provides a wide operating range, allowing flexibility in different power supply configurations.

Package Shape: SQUARE

Space-efficient design that optimizes board layout and helps in fitting the product in compact spaces.

No. of Terminals: 14

Sufficient number of terminals for connecting various components, ensuring compatibility with different systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of styles that enhance thermal performance, maintain a low profile, and improve overall reliability.

Minimum Supply Voltage: 4.4 V

Allows operation in environments where the power supply may fluctuate slightly below the maximum voltage.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications that involve heat exposure.

Maximum Data Transfer Rate: 60.03 MBps

High-speed data transfer capability enables efficient communication within the system, reducing latency.

Minimum Operating Temperature: -40 °C

Operational in extremely cold environments, ensuring functionality in a wide range of temperature conditions.

Terminal Finish: MATTE TIN

Provides a corrosion-resistant finish on the terminals, ensuring stable electrical connections over time.

Terminal Position: QUAD

Quad terminal position enables easy soldering and connection, enhancing the product's overall reliability.

Maximum Seated Height: 1 mm

Low seated height allows for a compact overall design, facilitating installation in tight spaces.

Width: 3.5 mm

Compact width dimensions contribute to the product's flexibility and compatibility with various board layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized reflow time ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

Ability to withstand high reflow temperatures ensures durability during the assembly process.

Length: 3.5 mm

Compact length design aids in space-saving on the PCB, contributing to efficient board layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable performance in harsh operating conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Supports various bus protocols, enhancing compatibility with different devices and systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations and reduce the risk of harmful substances.

Maximum Supply Current: 0.03 mA

Low supply current consumption minimizes power usage, contributing to energy efficiency.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage provides compatibility with common power sources, ensuring ease of integration.

Bus Compatibility: I2C

Support for I2C bus communication enables connectivity with a wide range of devices, enhancing versatility.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling more connections in a limited space.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate moisture sensitivity during storage and handling, ensuring product reliability.

Technical Specifications

Bus Controllers TUSB213IRGYT attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Bus Compatibility:

I2C

Maximum Data Transfer Rate:

60.03 MBps

JESD-30 Code:

S-PQCC-N14

JESD-609 Code:

e3

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

.03 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

TUSB213IRGYT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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