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TSB41AB3IPFP

Texas Instruments

TSB41AB3IPFP by Texas Instruments

TSB41AB3IPFP by Texas Instruments is a CMOS Line Transceiver with 6-bit driver and receiver. It operates at 3.3V, supports IEEE 1394 interface standard, and has a max output low current of 4A. Ideal for industrial applications requiring differential outputs with Schmitt trigger input characteristics.

Median Price

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Lifecycle Status

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7

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1k+

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Vyrian

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Digiode

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LIBRA Elektronik GmbH

Germany . 57 parts In-Stock

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Whistler Technology

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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LWI Electronics Inc

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R&J Components

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Parana Technologies

USA . 1,072 parts In-Stock

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DigiPath Technology Company

USA . 825 parts In-Stock

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ChromeModa Solutions

Germany . 1,378 parts In-Stock

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$4.740

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IDEA Electronic Components Group

UK . 610 parts In-Stock

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AZTECH Wire

Italy . 220 parts In-Stock

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One Stop Electronics

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Authorized Procurement Solutions

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Corphita

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Microchip USA

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Overview

Experience the superior quality and reliability of Texas Instruments with the TSB41AB3IPFP Line Driver & Receiver. This versatile component offers unmatched performance in a wide range of applications, from industrial automation to consumer electronics. With its advanced technology and innovative design, this product provides exceptional value and benefits to customers seeking top-notch connectivity solutions. Trust Texas Instruments for cutting-edge solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy materials provide durability and resistance to external factors, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing production time and costs.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage ensures compatibility with a wide range of systems and applications.

No. of Functions: 6

Having multiple functions in a single package provides cost-effectiveness and space efficiency in circuit design.

Package Shape: SQUARE

Square package shape allows for easy integration and placement on the PCB, optimizing board space.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with common power sources and components.

No. of Terminals: 80

Having a high number of terminals allows for versatile connectivity options and signal routing in complex circuits.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Different package styles offer flexibility in mounting and heat dissipation, catering to specific application requirements.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures efficient power consumption and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliability and performance under harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold environments without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance for reliable signal transmission.

Terminal Position: QUAD

Quad terminal position offers stability and secure connection to the PCB, minimizing signal interference and losses.

Maximum Seated Height: 1.2 mm

Low maximum seated height provides a slim profile for the product, saving space and allowing for compact device designs.

Width: 12 mm

Standard width dimension facilitates easy integration and installation in various electronic systems and devices.

Maximum Output Low Current: 4 Amp

High maximum output current rating enables driving of power-hungry loads without overheating or performance degradation.

Receiver No. of Bits: 6

Having 6 bits in the receiver ensures accurate signal processing and data transmission, improving overall system performance.

Differential Output: YES

Differential output enhances noise immunity and signal integrity, making the product suitable for high-speed data communication.

Length: 12 mm

Standard length dimension allows for easy integration and placement on the PCB, optimizing board space and layout.

Minimum Out Swing: 0.172 V

Low minimum output swing helps in minimizing signal distortion and noise, ensuring reliable data transmission.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stable operation in harsh industrial environments with varying temperature conditions.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time signal processing and quick response, critical for applications requiring low latency.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and robust performance, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering and connection to the PCB, offering mechanical strength and reliability.

Interface Standard: IEEE 1394

Compliance with IEEE 1394 standard ensures compatibility and interoperability with a wide range of devices and systems.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input characteristics help in noise filtering and signal conditioning, improving signal quality and reliability.

Nominal Supply Voltage: 3.3 V

Having a standard nominal supply voltage of 3.3V ensures compatibility with common power sources and components, simplifying system integration.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and compact PCB design, saving space and improving signal routing efficiency.

Driver No. of Bits: 6

Having 6 bits in the driver enables accurate signal generation and transmission, ensuring reliable communication and data transfer.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the product can withstand standard moisture exposure during storage and handling, ensuring product reliability and lifespan.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type provides signal conversion and processing capabilities, making the product versatile and suitable for various communication protocols.

Technical Specifications

Line Drivers & Receivers TSB41AB3IPFP attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

6

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

6

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.172 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

6

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

TSB41AB3IPFP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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