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TSB41AB3IPFPG4

Texas Instruments

TSB41AB3IPFPG4 by Texas Instruments

TSB41AB3IPFPG4 by Texas Instruments is a CMOS Line Transceiver with 6-bit driver and receiver. It operates at 3.3V, supports IEEE 1394 interface standard, and has a max output low current of 4A. Ideal for industrial applications requiring differential input characteristics and high-speed data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,272 parts In-Stock

1+ parts

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5,272

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Digiode

USA . 1,121 parts In-Stock

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1,121

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,537 parts In-Stock

1+ parts

$9.599

100+ parts

-

1k+ parts

$10.191

10k+ parts

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1,537

$9.599

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$10.191

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DigiPath Technology Company

USA . 1,327 parts In-Stock

1+ parts

$10.569

100+ parts

-

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1,327

$10.569

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IDEA Electronic Components Group

UK . 1,670 parts In-Stock

1+ parts

$10.785

100+ parts

$10.246

1k+ parts

$9.706

10k+ parts

-

1,670

$10.785

$10.246

$9.706

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ChromeModa Solutions

Germany . 601 parts In-Stock

1+ parts

$10.785

100+ parts

$8.844

1k+ parts

-

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601

$10.785

$8.844

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AZTECH Wire

Italy . 633 parts In-Stock

1+ parts

$18.362

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633

$18.362

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One Stop Electronics

USA . 150 parts In-Stock

1+ parts

$46.500

100+ parts

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150

$46.500

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Corphita

USA . 1,900 parts In-Stock

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1,900

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Overview

Unlock the potential of your electronic devices with the TSB41AB3IPFPG4 by Texas Instruments, a top-tier manufacturer known for quality and reliability. This line driver & receiver offers seamless connectivity and high-performance in a compact package, making it ideal for a wide range of applications. With advanced technology and superior design, this product ensures consistent signal transmission and efficient data transfer. Experience the value and benefits that the TSB41AB3IPFPG4 brings to your projects, setting you apart from the competition. Elevate your electronics with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration into circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages for increased flexibility in power requirements.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with wide operating temperature range.

Interface Standard: IEEE 1394

Complies with standard interface protocols for seamless integration with other devices.

Technical Specifications

Line Drivers & Receivers TSB41AB3IPFPG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

6

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

6

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.172 V

Maximum Output Low Current:

4 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

6

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

TSB41AB3IPFPG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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