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TSB41AB1PAPG4

Texas Instruments

TSB41AB1PAPG4 by Texas Instruments

TSB41AB1PAPG4 by Texas Instruments is a Line Driver & Receiver with 64 terminals, operating at 3.6V max supply voltage. It features IEEE 1394 interface standard, CMOS technology, and differential output polarity. Ideal for commercial applications requiring high-speed data transmission in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,452 parts In-Stock

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Digiode

USA . 2,254 parts In-Stock

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Parana Technologies

USA . 1,340 parts In-Stock

1+ parts

$7.871

100+ parts

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$8.425

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$7.871

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$8.425

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AZTECH Wire

Italy . 675 parts In-Stock

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$8.448

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DigiPath Technology Company

USA . 149 parts In-Stock

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$8.667

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149

$8.667

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ChromeModa Solutions

Germany . 3,732 parts In-Stock

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$8.844

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$7.252

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IDEA Electronic Components Group

UK . 2,241 parts In-Stock

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$8.844

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$8.402

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$7.960

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2,241

$8.844

$8.402

$7.960

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One Stop Electronics

USA . 381 parts In-Stock

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$17.500

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381

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Kepictronics

USA . 6,524 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,617 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 2,302 parts In-Stock

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Microchip USA

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Overview

Elevate your connectivity with the TSB41AB1PAPG4 by Texas Instruments, a top-tier manufacturer known for its quality products. As a versatile Line Driver & Receiver, this device offers seamless integration in various applications. Experience the value of reliable performance and efficient data transmission, thanks to its advanced technology and superior design. Stay ahead of the curve with Texas Instruments and unlock new possibilities in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and providing efficient assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, the product can handle a wide range of operating conditions effectively.

No. of Functions: 2

Having multiple functions in one device can simplify circuit design and reduce the need for additional components.

Package Shape: SQUARE

The square package shape offers ease of handling and mounting on the PCB, ensuring a secure fit.

Power Supplies (V): 3/3.3

Support for multiple power supply voltages allows for flexible integration into different systems and environments.

No. of Terminals: 64

Having a high number of terminals provides connectivity options and allows for precise signal routing in the circuit.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes the product suitable for use in various environmental conditions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in elevated temperature environments.

Output Characteristics: DIFFERENTIAL

Differential output ensures improved noise immunity and signal integrity, making it ideal for high-speed data transmission.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Interface Standard: IEEE 1394

Compliance with the IEEE 1394 standard ensures compatibility with a wide range of devices and systems.

Technical Specifications

Line Drivers & Receivers TSB41AB1PAPG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

.172 V

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TSB41AB1PAPG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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