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TSB21LV03CPM

Texas Instruments

TSB21LV03CPM by Texas Instruments

TSB21LV03CPM by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 2.7-3.6V. It features a CMOS technology, IEEE 1394 interface standard, and differential output for applications requiring high-speed data transmission in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,720 parts In-Stock

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6,720

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Digiode

USA . 3,490 parts In-Stock

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3,490

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Pegasus Components GmbH

Germany . 22 parts In-Stock

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22

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,017 parts In-Stock

1+ parts

$6.052

100+ parts

-

1k+ parts

$6.829

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2,017

$6.052

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$6.829

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DigiPath Technology Company

USA . 778 parts In-Stock

1+ parts

$6.664

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778

$6.664

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ChromeModa Solutions

Germany . 1,922 parts In-Stock

1+ parts

$6.800

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$5.576

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1,922

$6.800

$5.576

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IDEA Electronic Components Group

UK . 842 parts In-Stock

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$6.800

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$6.120

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842

$6.800

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$6.120

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AZTECH Wire

Italy . 361 parts In-Stock

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$10.863

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361

$10.863

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One Stop Electronics

USA . 1,233 parts In-Stock

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$33.500

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$33.500

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Corphita

USA . 1,548 parts In-Stock

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1,548

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the TSB21LV03CPM Line Driver & Receiver. This innovative product offers cutting-edge technology in a compact and efficient package, making it ideal for a wide range of applications. With a maximum supply voltage of 3.6V and a minimum operating temperature of 0°C, this device provides exceptional performance and versatility. Trust in Texas Instruments to deliver superior products that meet your needs and exceed your expectations. Elevate your projects with the TSB21LV03CPM today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

The surface mount feature allows for easy installation on printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 3

Having multiple functions in one component helps simplify circuit design and reduce the number of components needed.

Package Shape: SQUARE

The square shape allows for efficient use of board space and easy integration into the overall circuit design.

Power Supplies (V): 3/3.3

Compatible with standard power supply voltages, ensuring compatibility with existing systems.

No. of Terminals: 64

Having a high number of terminals provides flexibility in connecting to other components or systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for efficient heat dissipation and space-saving on the PCB.

Minimum Supply Voltage: 2.7 V

Supports a low minimum supply voltage, suitable for battery-operated devices or low-power applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can operate reliably in a variety of environments.

Minimum Operating Temperature: 0 °C

Can operate in cold temperature conditions without compromising performance.

Terminal Position: QUAD

The quad terminal position provides a stable connection and efficient signal transmission.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a slim profile, ideal for space-constrained applications.

Width: 10 mm

Compact width size makes it easy to integrate into crowded PCB layouts.

Maximum Output Low Current: 12 Amp

Capable of handling high output current, suitable for driving demanding loads.

Receiver No. of Bits: 6

Provides a high-resolution signal reception, ensuring accurate data transmission.

Differential Output: YES

Differential output helps to minimize electromagnetic interference and noise, improving signal integrity.

Length: 10 mm

Compact length size for efficient use of space on the PCB.

Minimum Out Swing: 0.17 V

Low minimum output swing voltage for efficient data transmission with minimal power consumption.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, ensuring reliability and performance in typical operating conditions.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time data transmission, critical for time-sensitive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for a wide range of applications.

Terminal Form: GULL WING

Gull wing terminals provide a robust connection and ease of soldering during assembly.

Interface Standard: IEEE 1394

Complies with the IEEE 1394 standard for high-speed data communication, ensuring compatibility with other devices.

Maximum Supply Current: 175 mA

Low maximum supply current consumption for energy-efficient operation.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input ensures noise immunity and reliable signal detection.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent performance across operating conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density integration and efficient signal transmission.

Driver No. of Bits: 6

Six driver bits provide a higher resolution in signal transmission, ensuring accurate data delivery.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, the IC can transmit and receive data signals efficiently in a bidirectional communication system.

Technical Specifications

Line Drivers & Receivers TSB21LV03CPM attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

6

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

3

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

.17 V

Maximum Output Low Current:

12 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

6

Maximum Seated Height:

1.6 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

175 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

TSB21LV03CPM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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