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TSB21LV03BIPM

Texas Instruments

TSB21LV03BIPM by Texas Instruments

TSB21LV03BIPM by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3-3.3V. It features a CMOS technology, IEEE 1394 interface standard, and differential output. Ideal for industrial applications requiring high-speed data transmission in tight spaces due to its low profile flatpack design and fine pitch terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,434 parts In-Stock

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8,434

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Digiode

USA . 1,296 parts In-Stock

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1,296

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 530 parts In-Stock

1+ parts

$4.549

100+ parts

-

1k+ parts

$4.996

10k+ parts

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530

$4.549

-

$4.996

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ChromeModa Solutions

Germany . 6,797 parts In-Stock

1+ parts

$5.111

100+ parts

$4.191

1k+ parts

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6,797

$5.111

$4.191

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IDEA Electronic Components Group

UK . 461 parts In-Stock

1+ parts

$5.111

100+ parts

-

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$4.600

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461

$5.111

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$4.600

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AZTECH Wire

Italy . 451 parts In-Stock

1+ parts

$18.434

100+ parts

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451

$18.434

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One Stop Electronics

USA . 752 parts In-Stock

1+ parts

$41.500

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752

$41.500

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Corphita

USA . 4,384 parts In-Stock

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4,384

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DigiPath Technology Company

USA . 34 parts In-Stock

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$4.608

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34

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$4.608

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Overview

Elevate your electronics with the TSB21LV03BIPM by Texas Instruments, a top-of-the-line Line Driver & Receiver. Crafted from high-quality materials and boasting cutting-edge technology, this product offers unmatched reliability and performance. Ideal for industrial applications, this compact and versatile component delivers seamless connectivity and precision functionality. Experience the difference with Texas Instruments and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 3

Offers multiple functions in a single device, providing cost-effectiveness and space-saving benefits.

Package Shape: SQUARE

Helps in efficient PCB layout and space utilization, especially in compact designs.

Power Supplies (V): 3/3.3

Compatible with common power supply voltages, making it easy to integrate into existing systems.

No. of Terminals: 64

Provides ample connection points for various inputs and outputs, enabling versatile connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates a compact and streamlined design for space-constrained applications.

Minimum Supply Voltage: 3 V

Ensures reliable operation even at lower supply voltages, enhancing the product's performance in different scenarios.

Maximum Operating Temperature: 85 °C

Allows the product to operate in a wide temperature range, suitable for industrial and harsh environments.

Minimum Operating Temperature: -40 °C

Can withstand extremely low temperatures, making it suitable for use in cold environments.

Terminal Position: QUAD

Enables easy and organized connection of multiple terminals, simplifying the installation process.

Maximum Seated Height: 1.6 mm

Ensures a low-profile design, suitable for compact spaces and slim devices.

Width: 10 mm

Compact width allows for space-efficient placement on circuit boards.

Maximum Output Low Current: 12 Amp

Capable of driving high current loads, making it suitable for demanding applications.

Receiver No. of Bits: 2

Supports communication with devices that transmit data in 2-bit format.

Differential Output: YES

Provides noise immunity and accurate data transmission over long distances.

Length: 10 mm

Compact length contributes to a space-saving design for various applications.

Minimum Out Swing: 0.172 V

Ensures a reliable output swing even at lower voltage levels.

Temperature Grade: INDUSTRIAL

Guarantees reliable performance in harsh industrial environments with extreme temperature variations.

Maximum Receive Delay: 0 ns

Minimal delay in receiving signals ensures real-time data transmission.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and reliable signal processing.

Terminal Form: GULL WING

Promotes easy installation on circuit boards and provides secure terminal connections.

Interface Standard: IEEE 1394

Complies with the IEEE 1394 standard for high-speed data communication and compatibility with other devices.

Maximum Supply Current: 175 mA

Efficient power consumption with a low supply current requirement.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Utilizes a differential Schmitt trigger for accurate and reliable input signal processing.

Nominal Supply Voltage: 3.3 V

Designed for optimal performance at a nominal supply voltage of 3.3V.

Terminal Pitch: 0.5 mm

Compact terminal pitch facilitates high-density PCB designs and space-efficient layouts.

Driver No. of Bits: 2

Supports communication with devices that transmit data in 2-bit format.

Interface IC Type: LINE TRANSCEIVER

Functions as a line transceiver for reliable data transmission between different devices.

Technical Specifications

Line Drivers & Receivers TSB21LV03BIPM attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.172 V

Maximum Output Low Current:

12 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.6 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

175 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

TSB21LV03BIPM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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