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TSB21LV03CIPM

Texas Instruments

TSB21LV03CIPM by Texas Instruments

TSB21LV03CIPM by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 2.7-3.6V. It features a flatpack, low profile package style and Gull Wing terminal form for IEEE 1394 interface standard applications. With differential output and Schmitt trigger input characteristics, it offers high-speed data transmission in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,050 parts In-Stock

1+ parts

-

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7,050

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Digiode

USA . 4,333 parts In-Stock

1+ parts

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4,333

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Electronics Depot

USA . 563 parts In-Stock

1+ parts

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563

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 535 parts In-Stock

1+ parts

$3.173

100+ parts

-

1k+ parts

$3.694

10k+ parts

-

535

$3.173

-

$3.694

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DigiPath Technology Company

USA . 2,011 parts In-Stock

1+ parts

$3.494

100+ parts

$3.214

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-

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2,011

$3.494

$3.214

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ChromeModa Solutions

Germany . 1,865 parts In-Stock

1+ parts

$3.565

100+ parts

$2.923

1k+ parts

-

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1,865

$3.565

$2.923

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IDEA Electronic Components Group

UK . 645 parts In-Stock

1+ parts

$3.565

100+ parts

-

1k+ parts

$3.208

10k+ parts

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645

$3.565

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$3.208

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AZTECH Wire

Italy . 708 parts In-Stock

1+ parts

$18.832

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708

$18.832

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One Stop Electronics

USA . 165 parts In-Stock

1+ parts

$28.500

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165

$28.500

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Perfect Parts

USA . 1,015 parts In-Stock

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1,015

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GreenTree Electronics

Israel . 906 parts In-Stock

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906

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SIE Connect GmbH (Excess)

Germany . 393 parts In-Stock

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393

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Corphita

USA . 194 parts In-Stock

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194

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Overview

Enhance your electronic designs with the TSB21LV03CIPM from Texas Instruments, a leading manufacturer known for quality and reliability. As a Line Driver & Receiver, this versatile component offers seamless integration and superior performance in various applications. With a range of functions and advanced technology, customers can expect exceptional value, efficiency, and precision. Upgrade your projects with the TSB21LV03CIPM and experience the benefits of cutting-edge innovation at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a reliable performance over time.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, making it versatile for different applications.

No. of Functions: 3

Offers multiple functions in a single device, increasing efficiency and reducing the need for multiple components.

Package Shape: SQUARE

Compact square shape fits well on circuit boards, optimizing use of space.

Power Supplies (V): 3/3.3

Supports multiple power supply options, providing flexibility in design and compatibility with different systems.

No. of Terminals: 64

Plenty of terminals for connections, allowing for a high level of connectivity and functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Sleek and low profile design with fine pitch terminals enables space-saving and high-density mounting on PCBs.

Minimum Supply Voltage: 2.7 V

Works efficiently with low voltage inputs, suitable for a wide range of applications with varying power requirements.

Maximum Operating Temperature: 70 °C

Can operate effectively at high temperatures, ensuring reliability in harsh environments.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures without performance degradation, suitable for a variety of temperature conditions.

Terminal Position: QUAD

Quad terminal layout facilitates easy connection to external devices, simplifying installation and maintenance.

Maximum Seated Height: 1.6 mm

Low profile design with a compact height allows for space-efficient installation in tight spaces.

Width: 10 mm

Compact width ensures compatibility with standard PCB designs and allows for efficient use of board space.

Maximum Output Low Current: 12 Amp

Capable of delivering high current output, suitable for driving various loads and ensuring reliable performance.

Receiver No. of Bits: 6

6-bit receiver allows for precise and accurate signal reception, improving overall system performance.

Differential Output: YES

Differential output provides noise immunity and better signal integrity, ensuring high-quality data transmission.

Length: 10 mm

Compact length fits well on circuit boards, optimizing space usage and improving overall system design.

Minimum Out Swing: 0.17 V

Low minimum output swing ensures compatibility with a wide range of devices and systems, enhancing usability.

Temperature Grade: COMMERCIAL

Commercial-grade temperature range makes it suitable for standard operating environments, ensuring reliability in typical applications.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time data communication, crucial for time-sensitive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance and reliability.

Terminal Form: GULL WING

Gull wing terminal design provides strong mechanical connection, reducing the risk of solder joint failure and improving overall durability.

Interface Standard: IEEE 1394

Conforms to IEEE 1394 standard for data transmission, ensuring compatibility with a wide range of devices and systems.

Maximum Supply Current: 175 mA

Low supply current consumption reduces power usage and heat generation, increasing overall efficiency and reliability.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input ensures precise signal detection and noise immunity, enhancing signal integrity and quality.

Nominal Supply Voltage: 3 V

Stable 3V supply voltage ensures consistent and reliable operation, suitable for various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on PCBs, optimizing space usage and improving overall system design.

Driver No. of Bits: 6

6-bit driver provides precise control over output signals, enabling accurate and efficient data transmission.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type enables bidirectional data transmission, making it suitable for a wide range of communication systems.

Technical Specifications

Line Drivers & Receivers TSB21LV03CIPM attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

6

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

3

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

.17 V

Maximum Output Low Current:

12 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

6

Maximum Seated Height:

1.6 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

175 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

TSB21LV03CIPM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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