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TSB21LV03CMHVB

Texas Instruments

TSB21LV03CMHVB by Texas Instruments

TSB21LV03CMHVB by Texas Instruments is a CMOS line transceiver with 6-bit driver and receiver. It operates at 2.7-3.6V, ideal for IEEE 1394 interface applications in military-grade environments. With differential output and Schmitt trigger input, it ensures reliable data transmission up to 175mA supply current at -55 to 125°C temperature range.

Median Price

$79.312

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 448 parts In-Stock

1+ parts

-

100+ parts

$70.500

1k+ parts

$63.080

10k+ parts

$59.370

448

-

$70.500

$63.080

$59.370

DigiKey

USA . 448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

448

-

-

-

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Verical

USA . 448 parts In-Stock

1+ parts

-

100+ parts

$88.125

1k+ parts

$78.850

10k+ parts

$74.213

448

-

$88.125

$78.850

$74.213

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,785 parts In-Stock

1+ parts

$74.414

100+ parts

-

1k+ parts

-

10k+ parts

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1,785

$74.414

-

-

-

DigiKey Marketplace

USA . 448 parts In-Stock

1+ parts

$81.460

100+ parts

-

1k+ parts

-

10k+ parts

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448

$81.460

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-

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Vyrian

USA . 4,603 parts In-Stock

1+ parts

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4,603

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 458 parts In-Stock

1+ parts

$9.746

100+ parts

-

1k+ parts

$10.325

10k+ parts

-

458

$9.746

-

$10.325

-

DigiPath Technology Company

USA . 1,637 parts In-Stock

1+ parts

$10.731

100+ parts

-

1k+ parts

-

10k+ parts

-

1,637

$10.731

-

-

-

ChromeModa Solutions

Germany . 6,371 parts In-Stock

1+ parts

$10.950

100+ parts

$8.979

1k+ parts

-

10k+ parts

-

6,371

$10.950

$8.979

-

-

IDEA Electronic Components Group

UK . 1,168 parts In-Stock

1+ parts

$10.950

100+ parts

$10.402

1k+ parts

$9.855

10k+ parts

-

1,168

$10.950

$10.402

$9.855

-

Corphita

USA . 97 parts In-Stock

1+ parts

$70.497

100+ parts

-

1k+ parts

-

10k+ parts

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97

$70.497

-

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Component Stockers USA

USA . 491 parts In-Stock

1+ parts

$79.590

100+ parts

$74.810

1k+ parts

-

10k+ parts

-

491

$79.590

$74.810

-

-

Vigor

Singapore . 448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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448

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Overview

Unleash the power of cutting-edge technology with the TSB21LV03CMHVB by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-quality performance and reliability. This versatile line driver and receiver is designed to meet the demands of various applications, offering seamless integration and enhanced functionality. Elevate your projects with the TSB21LV03CMHVB and experience unmatched value, efficiency, and precision. Upgrade to Texas Instruments today and revolutionize your electronic designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability for the product, making it suitable for harsh operating environments.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options and allows for compatibility with a wide range of systems.

No. of Functions: 3

Having multiple functions in a single product reduces the need for additional components, simplifying circuit design and reducing overall system complexity.

Screening Level: 38535Q/M;38534H;883B

The high screening level indicates that the product meets stringent quality standards and is suitable for use in critical applications where reliability is paramount.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and facilitates easy integration into compact electronic systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the product can withstand elevated temperatures without performance degradation, making it suitable for industrial and automotive applications.

Technical Specifications

Line Drivers & Receivers TSB21LV03CMHVB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

6

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

IEEE 1394

JESD-30 Code:

S-CQFP-F68

Length:

12.51 mm

No. of Functions:

3

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

.17 V

Maximum Output Low Current:

12 Amp

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

QFF

Package Equivalence Code:

QFL68,.5SQ,25

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

6

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

3.86 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

175 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12.51 mm

Trade Compliance

TSB21LV03CMHVB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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