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TS5V330DRE4

Texas Instruments

TS5V330DRE4 by Texas Instruments

TS5V330DRE4 by Texas Instruments is a 4-function SPDT switch with 16 terminals, operating at -40 to 85°C. It has a max on-state resistance of 7 ohm and offers separate outputs. Ideal for industrial applications requiring a compact, surface-mountable solution with a nominal voltage of 5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,055 parts In-Stock

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Digiode

USA . 2,121 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,338 parts In-Stock

1+ parts

$4.500

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$4.500

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AZTECH Wire

Italy . 386 parts In-Stock

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$5.391

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386

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Semicontronic

India . 1,518 parts In-Stock

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$5.500

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$5.362

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$5.335

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1,518

$5.500

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$5.335

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Ampacity Inc.

Singapore . 551 parts In-Stock

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$5.500

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551

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Parana Technologies

USA . 718 parts In-Stock

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$6.175

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$6.942

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718

$6.175

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DigiPath Technology Company

USA . 156 parts In-Stock

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$6.799

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$6.255

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156

$6.799

$6.255

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ChromeModa Solutions

Germany . 3,438 parts In-Stock

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$6.938

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$5.689

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IDEA Electronic Components Group

UK . 2,219 parts In-Stock

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$6.938

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$6.244

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Corphita

USA . 1,823 parts In-Stock

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Corohmni

South Africa . 454 parts In-Stock

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Overview

Texas Instruments presents the TS5V330DRE4, a high-quality multiplexer and switch perfect for industrial applications. With Texas Instrument's reputation for excellence in engineering, this product offers superior performance, reliability, and durability. Its compact design and wide operating temperature range make it ideal for a variety of industrial settings. Experience seamless switching with minimal on-state resistance and ultra-fast switch-on and switch-off times. Trust Texas Instruments to deliver unmatched value and innovation with the TS5V330DRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 4

The multiplexer has 4 different functions, providing versatility and flexibility in signal switching applications.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard supply voltage of 5V, making it compatible with a wide range of circuits.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable performance in various operating conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, suitable for a wide range of environments.

Width (mm): 3.9 mm

Compact size allows for space-saving installation in crowded PCB layouts.

Minimum Supply Voltage (Vsup): 4 V

Can operate at lower supply voltages, providing flexibility in different power scenarios.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during reflow soldering processes, ensuring reliable assembly.

Nominal Off-state Isolation: 60 dB

Provides high isolation between channels, minimizing signal interference and improving signal quality.

Technical Specifications

Multiplexers & Switches TS5V330DRE4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

16

Nominal Off-state Isolation:

60 dB

Maximum On-state Resistance (Ron):

7 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

6 ns

Maximum Switch-on Time:

6 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TS5V330DRE4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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