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TS5V330CD

Texas Instruments

TS5V330CD by Texas Instruments

TS5V330CD by Texas Instruments is a 4-function SPDT switch with 16 terminals, operating b/w -40 to 85°C. With a max on-state resistance of 7 ohm and switching time of 6 ns, it's ideal for industrial applications requiring fast and efficient signal routing in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,762 parts In-Stock

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4,762

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Digiode

USA . 4,668 parts In-Stock

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4,668

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Distributors (Availability)

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AZTECH Wire

Italy . 704 parts In-Stock

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$5.442

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704

$5.442

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Semicontronic

India . 478 parts In-Stock

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$5.500

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$5.362

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$5.335

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478

$5.500

$5.362

$5.335

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Ampacity Inc.

Singapore . 1,094 parts In-Stock

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$6.500

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$6.500

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One Stop Electronics

USA . 1,369 parts In-Stock

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$7.500

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1,369

$7.500

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Parana Technologies

USA . 940 parts In-Stock

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$15.356

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$15.746

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940

$15.356

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$15.746

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DigiPath Technology Company

USA . 1,703 parts In-Stock

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$16.909

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$16.909

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IDEA Electronic Components Group

UK . 2,165 parts In-Stock

1+ parts

$17.254

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$16.391

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$15.529

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2,165

$17.254

$16.391

$15.529

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ChromeModa Solutions

Germany . 1,046 parts In-Stock

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$17.254

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$14.148

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$17.254

$14.148

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Corphita

USA . 3,215 parts In-Stock

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Corohmni

South Africa . 130 parts In-Stock

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Overview

Enhance your electronic designs with the TS5V330CD by Texas Instruments, a high-quality multiplexer & switch that offers exceptional performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, this versatile component is ideal for a wide range of applications. From consumer electronics to industrial automation, the TS5V330CD provides value by delivering seamless switching capabilities and superior functionality. Upgrade your projects today with the trusted name in semiconductor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Surface Mount: YES

Easy to install and saves space on the circuit board.

No. of Functions: 4

Provides versatility and flexibility in routing signals.

Nominal Supply Voltage (Vsup): 4.5 V

Optimal voltage for efficient performance.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without issues.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments without issues.

Output (V): SEPARATE OUTPUT

Provides separate output for better signal isolation.

Maximum Seated Height: 1.75 mm

Compact size for space-constrained applications.

Maximum On-state Resistance (Ron): 7 ohm

Low resistance for efficient signal transmission.

Maximum Switch-on Time: 6 ns

Fast switching time for quick signal routing.

Nominal Off-state Isolation: 54 dB

Provides good isolation between the input and output signals.

Technical Specifications

Multiplexers & Switches TS5V330CD attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

16

Nominal Off-state Isolation:

54 dB

Maximum On-state Resistance (Ron):

7 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

5.9 ns

Maximum Switch-on Time:

6 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TS5V330CD Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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