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TS5V330CDBR

Texas Instruments

TS5V330CDBR by Texas Instruments

TS5V330CDBR by Texas Instruments is a 4-function SPDT switch with 16 terminals, operating at -40 to 85°C. It has a max on-state resistance of 7 ohm and separate output voltage. Ideal for industrial applications requiring fast switching times (6 ns on, 5.9 ns off) and high isolation (54 dB).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,474 parts In-Stock

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5,474

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Digiode

USA . 1,859 parts In-Stock

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1,859

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 788 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

788

$0.500

$0.488

$0.485

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One Stop Electronics

USA . 974 parts In-Stock

1+ parts

$1.500

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-

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974

$1.500

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Ampacity Inc.

Singapore . 1,617 parts In-Stock

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$2.500

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1,617

$2.500

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AZTECH Wire

Italy . 846 parts In-Stock

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$5.261

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846

$5.261

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Parana Technologies

USA . 209 parts In-Stock

1+ parts

$16.959

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$17.188

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209

$16.959

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$17.188

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DigiPath Technology Company

USA . 1,167 parts In-Stock

1+ parts

$18.674

100+ parts

$17.180

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1,167

$18.674

$17.180

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ChromeModa Solutions

Germany . 3,583 parts In-Stock

1+ parts

$19.055

100+ parts

$15.625

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3,583

$19.055

$15.625

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IDEA Electronic Components Group

UK . 1,155 parts In-Stock

1+ parts

$19.055

100+ parts

$18.102

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$17.150

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1,155

$19.055

$18.102

$17.150

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Lixinc

USA . 3,885 parts In-Stock

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3,885

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Corphita

USA . 433 parts In-Stock

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433

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Corohmni

South Africa . 376 parts In-Stock

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376

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Overview

Discover the ultimate solution for your switching needs with the TS5V330CDBR by Texas Instruments. With a reputation for exceptional quality and reliability, Texas Instruments delivers top-notch performance in the Multiplexers & Switches category. This versatile product offers customers seamless functionality and ease of use, making it ideal for a wide range of applications. Trust in Texas Instruments to provide value, benefits, and advantages that will elevate your projects to new heights. Choose the TS5V330CDBR for unparalleled performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various electronic systems.

No. of Functions: 4

Having 4 functions in one device allows for efficient signal routing and multiplexing.

Nominal Supply Voltage (Vsup): 4.5 V

Nominal supply voltage of 4.5V ensures compatibility with a wide range of electronic applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C enables reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures functionality even in extreme cold environments.

Output (V): SEPARATE OUTPUT

Separate output feature allows for independent control of each function, enhancing flexibility in signal routing.

Maximum Switch-off Time: 5.9 ns

Fast maximum switch-off time of 5.9 nanoseconds ensures quick response and efficient signal switching.

Nominal Off-state Isolation: 54 dB

High off-state isolation of 54 decibels helps in minimizing signal interference and crosstalk between functions.

Switching (V): BREAK-BEFORE-MAKE

Break-before-make switching ensures smooth transition between functions without causing short circuits or signal distortion.

Technical Specifications

Multiplexers & Switches TS5V330CDBR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

6.2 mm

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

16

Nominal Off-state Isolation:

54 dB

Maximum On-state Resistance (Ron):

7 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

5.9 ns

Maximum Switch-on Time:

6 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

5.3 mm

Trade Compliance

TS5V330CDBR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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