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TS3V330DG4

Texas Instruments

TS3V330DG4 by Texas Instruments

TS3V330DG4 by Texas Instruments is a 4-function SPDT switch with 16 terminals, operating at a voltage of 3.3 V. With a max on-state resistance of 7 ohm and off-state isolation of 50 dB, it is ideal for industrial applications requiring fast switching times and high reliability in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,014 parts In-Stock

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Digiode

USA . 515 parts In-Stock

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515

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 876 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

876

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 1,522 parts In-Stock

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$2.500

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$2.500

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Ampacity Inc.

Singapore . 1,099 parts In-Stock

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$2.500

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$2.500

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Parana Technologies

USA . 1,594 parts In-Stock

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$4.364

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$4.781

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1,594

$4.364

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$4.781

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DigiPath Technology Company

USA . 2,264 parts In-Stock

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$4.805

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2,264

$4.805

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ChromeModa Solutions

Germany . 2,212 parts In-Stock

1+ parts

$4.903

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$4.020

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2,212

$4.903

$4.020

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IDEA Electronic Components Group

UK . 430 parts In-Stock

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$4.903

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$4.413

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430

$4.903

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$4.413

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AZTECH Wire

Italy . 192 parts In-Stock

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$9.622

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Corphita

USA . 2,785 parts In-Stock

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Corohmni

South Africa . 141 parts In-Stock

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Overview

Upgrade your electronic projects with the TS3V330DG4 by Texas Instruments, a high-quality multiplexer & switch that offers exceptional performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will exceed your expectations. Whether you're working on industrial automation, telecommunications, or consumer electronics, this versatile component provides seamless switching and superior functionality. Experience the value and benefits of the TS3V330DG4 in your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and lightweight, ideal for electronic devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and space.

No. of Functions: 4

Having 4 functions in one device provides versatility and flexibility in signal routing and processing.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with a wide range of electronic systems and components.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand challenging environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel-palladium-gold finish provides excellent conductivity and corrosion resistance for reliable performance.

Width (mm): 3.9 mm

The compact width of 3.9mm enables space-saving integration into compact electronic devices.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement of 3V allows for efficient power consumption and operation.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching feature ensures smooth and reliable signal switching without causing any disruptions or short circuits.

Technical Specifications

Multiplexers & Switches TS3V330DG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

16

Nominal Off-state Isolation:

50 dB

Maximum On-state Resistance (Ron):

7 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

3.5 ns

Maximum Switch-on Time:

6.5 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TS3V330DG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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