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TS3V330RGYR

Texas Instruments

TS3V330RGYR by Texas Instruments

TS3V330RGYR by Texas Instruments is a 4-channel SPDT switch with 10 ohm Ron, 300 kHz bandwidth, and 50 dB isolation. Ideal for industrial applications, it operates at -40 to 85 °C with a supply voltage range of 3-3.6 V. The chip carrier package has a compact size of 4x3.5 mm for space-constrained designs.

Median Price

$0.540

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 56,915 parts In-Stock

1+ parts

$0.598

100+ parts

$0.460

1k+ parts

$0.242

10k+ parts

-

56,915

$0.598

$0.460

$0.242

-

Rochester

USA . 157,500 parts In-Stock

1+ parts

-

100+ parts

$0.472

1k+ parts

$0.392

10k+ parts

$0.349

157,500

-

$0.472

$0.392

$0.349

DigiKey

USA . 157,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.590

10k+ parts

-

157,500

-

-

$0.590

-

Verical

USA . 152,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.490

10k+ parts

$0.436

152,500

-

-

$0.490

$0.436

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,599 parts In-Stock

1+ parts

$0.319

100+ parts

-

1k+ parts

-

10k+ parts

-

2,599

$0.319

-

-

-

Vyrian

USA . 1,347 parts In-Stock

1+ parts

$0.336

100+ parts

-

1k+ parts

-

10k+ parts

-

1,347

$0.336

-

-

-

DF Sales Co.

USA . 35 parts In-Stock

1+ parts

$0.480

100+ parts

-

1k+ parts

-

10k+ parts

-

35

$0.480

-

-

-

DF Sales Co.

USA . 35 parts In-Stock

1+ parts

$0.480

100+ parts

-

1k+ parts

-

10k+ parts

-

35

$0.480

-

-

-

Cyclops Electronics Ltd

UK . 910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

910

-

-

-

-

Prism Electronics

USA . 426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

426

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,028 parts In-Stock

1+ parts

$0.302

100+ parts

-

1k+ parts

-

10k+ parts

-

1,028

$0.302

-

-

-

Vigor

Singapore . 164,500 parts In-Stock

1+ parts

$0.340

100+ parts

-

1k+ parts

-

10k+ parts

-

164,500

$0.340

-

-

-

Parana Technologies

USA . 273 parts In-Stock

1+ parts

$13.128

100+ parts

-

1k+ parts

$13.631

10k+ parts

-

273

$13.128

-

$13.631

-

DigiPath Technology Company

USA . 1,262 parts In-Stock

1+ parts

$14.455

100+ parts

$13.299

1k+ parts

-

10k+ parts

-

1,262

$14.455

$13.299

-

-

IDEA Electronic Components Group

UK . 823 parts In-Stock

1+ parts

$14.750

100+ parts

$14.012

1k+ parts

$13.275

10k+ parts

-

823

$14.750

$14.012

$13.275

-

ChromeModa Solutions

Germany . 293 parts In-Stock

1+ parts

$14.750

100+ parts

$12.095

1k+ parts

-

10k+ parts

-

293

$14.750

$12.095

-

-

Kepictronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,487 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,487

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Overview

Discover the TS3V330RGYR by Texas Instruments, a high-quality multiplexer and switch designed to meet your specific application needs. With its innovative design and reliable performance, this product ensures seamless operation and maximum efficiency. Whether you're working on industrial automation, telecommunications, or consumer electronics, this versatile device offers unparalleled value and benefits. Trust in Texas Instruments' expertise in semiconductor manufacturing and elevate your projects with the TS3V330RGYR. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and insulation for the components, ensuring the product's reliability and longevity.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly process.

No. of Functions: 4

Provides versatility and flexibility in routing signals, making it suitable for various applications.

Nominal Supply Voltage (Vsup): 3.3 V

Operates efficiently at a standard voltage, ensuring compatibility with common power sources.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments or applications where heat may be a concern.

Maximum Seated Height: 1 mm

Compact size allows for space-saving design and easy integration into tight spaces.

Nominal Bandwidth: 300 kHz

Supports high-frequency signals, making it suitable for applications requiring fast data transmission.

Technical Specifications

Multiplexers & Switches TS3V330RGYR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

300 kHz

Maximum Input Voltage:

3.6 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Nominal Off-state Isolation:

50 dB

Maximum On-state Resistance (Ron):

10 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16/20,.14X.16,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.01 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

3.5 ns

Maximum Switch-on Time:

6.5 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

TS3V330RGYR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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