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TS3L100PWRG4

Texas Instruments

TS3L100PWRG4 by Texas Instruments

TS3L100PWRG4 by Texas Instruments is a 4-function SPDT switch with 15 ohm Ron, 7.5 ns switch-on time, and 0.128 A signal current. Ideal for applications requiring high-speed switching in commercial temperature grades. Package style: small outline, thin profile, shrink pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,117 parts In-Stock

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Digiode

USA . 440 parts In-Stock

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440

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Semicontronic

India . 913 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

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913

$2.500

$2.438

$2.425

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One Stop Electronics

USA . 167 parts In-Stock

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$2.500

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167

$2.500

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Ampacity Inc.

Singapore . 1,030 parts In-Stock

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$5.500

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$5.500

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Parana Technologies

USA . 177 parts In-Stock

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$14.672

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$15.112

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177

$14.672

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$15.112

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AZTECH Wire

Italy . 755 parts In-Stock

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$16.445

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755

$16.445

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ChromeModa Solutions

Germany . 6,111 parts In-Stock

1+ parts

$16.485

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$13.518

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6,111

$16.485

$13.518

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IDEA Electronic Components Group

UK . 2,054 parts In-Stock

1+ parts

$16.485

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$15.661

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$14.836

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2,054

$16.485

$15.661

$14.836

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QUARKTWIN TECHNOLOGY LTD

USA . 7,751 parts In-Stock

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Corphita

USA . 4,930 parts In-Stock

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DigiPath Technology Company

USA . 1,888 parts In-Stock

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$14.863

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Microchip USA

USA . 1,737 parts In-Stock

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Corohmni

South Africa . 101 parts In-Stock

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Overview

Upgrade your system with the TS3L100PWRG4 by Texas Instruments, a top-quality multiplexer and switch designed to enhance performance and reliability. With 4 functions in a compact package, this versatile component is ideal for a wide range of applications. Texas Instruments' reputation for excellence ensures that you're getting a product that delivers on its promises. Experience seamless switching, minimal signal distortion, and improved efficiency with the TS3L100PWRG4 - your key to unlocking a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the multiplexer, ensuring long-term reliability.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V nominal supply voltage ensures compatibility with common power sources, making it easy to integrate into existing systems.

Maximum On-state Resistance (Ron): 15 ohm

The low on-state resistance of 15 ohms minimizes signal loss and ensures efficient signal transmission through the multiplexer.

No. of Functions: 4

With 4 functions available, this multiplexer provides versatility and flexibility in routing signals, making it suitable for various applications.

Maximum Supply Current (Isup): 0.01 mA

The low supply current requirement of 0.01 mA helps in reducing power consumption and heat dissipation, contributing to energy efficiency.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation within a typical temperature range, making it suitable for standard commercial applications.

Technical Specifications

Multiplexers & Switches TS3L100PWRG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

350 kHz

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

16

Nominal Off-state Isolation:

42 dB

Nominal On-state Resistance Match:

1 ohm

Maximum On-state Resistance (Ron):

15 ohm

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Signal Current:

.128 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.01 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

3.5 ns

Maximum Switch-on Time:

7.5 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

TS3L100PWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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