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TS3L110DBQRG4

Texas Instruments

TS3L110DBQRG4 by Texas Instruments

TS3L110DBQRG4 by Texas Instruments is a 4-function SPDT switch with 16 terminals, operating at -40 to 85°C. It has a max on-state resistance of 8 ohm and switching time of 7 ns. Ideal for industrial applications requiring separate outputs and high isolation levels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,464 parts In-Stock

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4,464

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Vyrian

USA . 4,324 parts In-Stock

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4,324

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,984 parts In-Stock

1+ parts

$1.026

100+ parts

-

1k+ parts

$1.896

10k+ parts

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1,984

$1.026

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$1.896

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DigiPath Technology Company

USA . 961 parts In-Stock

1+ parts

$1.130

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-

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961

$1.130

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IDEA Electronic Components Group

UK . 2,112 parts In-Stock

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$1.153

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$1.038

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2,112

$1.153

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$1.038

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ChromeModa Solutions

Germany . 11 parts In-Stock

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$1.153

100+ parts

$0.945

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11

$1.153

$0.945

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Ampacity Inc.

Singapore . 834 parts In-Stock

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$4.500

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834

$4.500

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One Stop Electronics

USA . 171 parts In-Stock

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$7.500

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171

$7.500

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AZTECH Wire

Italy . 719 parts In-Stock

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$7.549

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719

$7.549

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Corohmni

South Africa . 348 parts In-Stock

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$23.168

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348

$23.168

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Continental Prestige Electronics

USA . 5,833 parts In-Stock

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Corphita

USA . 2,661 parts In-Stock

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Microchip USA

USA . 2,167 parts In-Stock

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Advanced Electronics

New Zealand . 650 parts In-Stock

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650

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Argo Parts USA

USA . 71 parts In-Stock

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71

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Overview

Unlock a world of possibilities with the TS3L110DBQRG4 by Texas Instruments. Crafted with precision and expertise, this multiplexer switch offers unparalleled performance and reliability in various applications. Whether you're designing high-speed data acquisition systems or implementing signal routing in industrial settings, this versatile component delivers seamless operation and optimal functionality. Trust in Texas Instruments to provide cutting-edge solutions that elevate your projects to new heights. Experience the difference with the TS3L110DBQRG4 and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and resistance to environmental factors, making this product suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs, making it convenient for compact designs.

No. of Functions: 4

Having 4 functions in one multiplexer or switch allows for versatility in routing signals, offering flexibility in system design.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with common power sources, making integration easy.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environments and maintain performance under elevated temperatures.

Nominal Bandwidth: 500 kHz

The high nominal bandwidth of 500 kHz enables fast signal processing and transmission, ideal for applications requiring rapid data transfer.

Technical Specifications

Multiplexers & Switches TS3L110DBQRG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

500 kHz

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

16

Nominal Off-state Isolation:

28 dB

Nominal On-state Resistance Match:

.9 ohm

Maximum On-state Resistance (Ron):

8 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Signal Current:

.128 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

1.5 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

5 ns

Maximum Switch-on Time:

7 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TS3L110DBQRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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