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TS3L100DGVRE4

Texas Instruments

TS3L100DGVRE4 by Texas Instruments

TS3L100DGVRE4 by Texas Instruments is a 4-function SPDT switch with 15 ohm Ron, 0.128 A signal current, and 42 dB isolation. It operates at 3.3 V with a max temp of 70°C. Ideal for commercial applications requiring fast switching and low on-state resistance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,217 parts In-Stock

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Digiode

USA . 2,938 parts In-Stock

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2,938

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Distributors (Availability)

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Ampacity Inc.

Singapore . 863 parts In-Stock

1+ parts

$0.500

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863

$0.500

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One Stop Electronics

USA . 672 parts In-Stock

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$0.500

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672

$0.500

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Parana Technologies

USA . 863 parts In-Stock

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$4.278

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$4.707

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863

$4.278

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$4.707

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IDEA Electronic Components Group

UK . 1,674 parts In-Stock

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$4.807

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$4.326

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1,674

$4.807

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$4.326

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ChromeModa Solutions

Germany . 161 parts In-Stock

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$4.807

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$3.942

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161

$4.807

$3.942

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AZTECH Wire

Italy . 792 parts In-Stock

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$5.576

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792

$5.576

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Semicontronic

India . 870 parts In-Stock

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$7.500

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$7.312

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$7.275

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870

$7.500

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$7.275

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Corphita

USA . 3,957 parts In-Stock

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DigiPath Technology Company

USA . 1,586 parts In-Stock

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$4.334

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1,586

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$4.334

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Corohmni

South Africa . 472 parts In-Stock

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Overview

Enhance your electronic designs with the TS3L100DGVRE4 from Texas Instruments, a top-quality multiplexer and switch offering unmatched reliability and performance. This versatile component is perfect for a wide range of applications, providing seamless switching capabilities with minimal on-state resistance and maximum signal current. With its advanced technology and durable construction, this product ensures optimal functionality and efficiency for your projects, delivering exceptional value and benefits to customers seeking superior electronic solutions. Choose Texas Instruments for cutting-edge innovation and elevate your designs to new heights with the TS3L100DGVRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it easy to handle and resistant to damage.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort in the manufacturing process.

No. of Functions: 4

Having 4 functions in one component offers versatility and flexibility in designing and creating complex electronic circuits.

Nominal Supply Voltage (Vsup): 3.3 V

The specified nominal supply voltage ensures compatibility with common voltage levels in electronic systems, making integration seamless.

No. of Terminals: 16

With 16 terminals, this multiplexer & switches product can accommodate multiple connections, enabling a wider range of applications and circuit configurations.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliability and stability under challenging environmental conditions, making it suitable for industrial or outdoor use.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature guarantees performance even in cold environments, expanding the range of applications for this product.

Maximum On-state Resistance (Ron): 15 ohm

The low on-state resistance minimizes power loss and signal distortion, ensuring efficient and accurate switching in the circuit.

Maximum Switch-on Time: 7.5 ns

The fast switch-on time ensures quick response and minimal delay in signal transmission, crucial for high-speed applications.

Temperature Grade: COMMERCIAL

Being designed for commercial temperature ranges, this product is suitable for a wide range of applications in everyday electronic devices and systems.

Technical Specifications

Multiplexers & Switches TS3L100DGVRE4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

16

Nominal Off-state Isolation:

42 dB

Nominal On-state Resistance Match:

1 ohm

Maximum On-state Resistance (Ron):

15 ohm

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Signal Current:

.128 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.003 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

3.5 ns

Maximum Switch-on Time:

7.5 ns

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.6 mm

Trade Compliance

TS3L100DGVRE4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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