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TRSF3222ECDW

Texas Instruments

TRSF3222ECDW by Texas Instruments

TRSF3222ECDW by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3/5V. It has a max output low current of 1.6A and interface standard EIA-232-F; TIA-232-F; V.28. Ideal for commercial applications requiring reliable data transmission in temperature range of 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,385 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,385

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Digiode

USA . 2,467 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,467

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 264 parts In-Stock

1+ parts

$3.752

100+ parts

-

1k+ parts

$4.250

10k+ parts

-

264

$3.752

-

$4.250

-

ChromeModa Solutions

Germany . 1,276 parts In-Stock

1+ parts

$4.216

100+ parts

$3.457

1k+ parts

-

10k+ parts

-

1,276

$4.216

$3.457

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IDEA Electronic Components Group

UK . 664 parts In-Stock

1+ parts

$4.216

100+ parts

-

1k+ parts

$3.794

10k+ parts

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664

$4.216

-

$3.794

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AZTECH Wire

Italy . 374 parts In-Stock

1+ parts

$19.520

100+ parts

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1k+ parts

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10k+ parts

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374

$19.520

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One Stop Electronics

USA . 1,444 parts In-Stock

1+ parts

$23.500

100+ parts

-

1k+ parts

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10k+ parts

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1,444

$23.500

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Component Stockers USA

USA . 659 parts In-Stock

1+ parts

$99.990

100+ parts

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1k+ parts

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10k+ parts

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659

$99.990

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Corphita

USA . 4,970 parts In-Stock

1+ parts

-

100+ parts

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4,970

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DigiPath Technology Company

USA . 828 parts In-Stock

1+ parts

-

100+ parts

$3.801

1k+ parts

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10k+ parts

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828

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$3.801

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Microchip USA

USA . 367 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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367

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Overview

Elevate your next project with the TRSF3222ECDW by Texas Instruments, a top-tier manufacturer renowned for its quality and innovation. As part of the Line Drivers & Receivers category, this product offers unmatched reliability and performance in various applications. With a compact package style and dual terminal position, this line transceiver delivers seamless connectivity and superior functionality. Experience the value and benefits of Texas Instruments technology with the TRSF3222ECDW - the perfect choice for your next design endeavor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the line driver & receiver, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes the installation process easier and more efficient, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

The ability to handle a maximum supply voltage of 3.6V makes this product versatile and compatible with a wide range of systems and applications.

No. of Functions: 2

Having multiple functions in a single device increases efficiency and saves space on the circuit board, making it a cost-effective solution.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor that is easy to integrate into various electronic designs.

Power Supplies (V): 3.3/5

Supporting dual power supply voltages of 3.3V and 5V offers flexibility in system design and compatibility with different power sources.

No. of Terminals: 20

Having a high number of terminals allows for multiple connections and configurations, enhancing the versatility and functionality of the device.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices and applications with limited real estate.

Maximum High Level Input Current: 0.000001 Amp

This low input current requirement results in minimal power consumption and reduced heat generation, enhancing the overall efficiency of the system.

Minimum Supply Voltage: 3 V

The ability to operate at a minimum supply voltage of 3V ensures compatibility with a wide range of power sources and systems.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this device can withstand harsh environmental conditions and maintain reliable performance under heat stress.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the device can function efficiently even in colder environments, making it suitable for a variety of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in installation and connection options, accommodating different circuit layouts and configurations.

Maximum Seated Height: 2.65 mm

The low seated height makes the device suitable for compact electronic designs with limited space constraints, enabling versatile integration in various applications.

Width: 7.5 mm

The narrow width of 7.5mm facilitates efficient PCB layout and component placement, optimizing space utilization and design flexibility.

Maximum Output Low Current: 1.6 Amp

Capable of high output current of 1.6A, this device can drive demanding loads efficiently and reliably, making it suitable for power-intensive applications.

Receiver No. of Bits: 2

The 2-bit receiver allows for effective data transmission and reception, enabling accurate and reliable communication between devices.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, the device can undergo reflow soldering process efficiently and reliably, ensuring secure connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and bonding during manufacturing processes, resulting in durable and stable connections.

Length: 12.8 mm

The moderate length of 12.8mm provides a balanced form factor that can be easily integrated into various electronic designs without compromising space efficiency.

Minimum Out Swing: 10 V

The minimum output swing of 10V ensures reliable signal transmission and reception, supporting communication with compatible devices and systems.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, this product meets industry standards for performance and reliability in typical operating environments.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time data transmission and reception, enabling immediate response and communication in time-critical applications.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable solder connections during installation, ensuring robust electrical connections and long-term performance.

Interface Standard: EIA-232-F; TIA-232-F; V.28

Support for multiple interface standards ensures compatibility with various communication protocols and systems, making it a versatile and adaptable solution.

Maximum Supply Current: 1 mA

Low supply current of 1mA results in minimal power consumption, enhancing energy efficiency and reducing operating costs in the long run.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics provide noise immunity and signal conditioning, ensuring stable and accurate data transmission in noisy environments.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources and systems, simplifying integration and operation in various applications.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm allows for compact PCB layout and efficient component placement, optimizing space utilization and design flexibility.

Driver No. of Bits: 2

The 2-bit driver enables efficient data transmission and reception, supporting reliable communication and signal integrity in digital systems.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this product can efficiently transmit and receive signals between different systems or components, facilitating effective communication and data transfer.

Technical Specifications

Line Drivers & Receivers TRSF3222ECDW attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TRSF3222ECDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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