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TRSF3232ECDRG4

Texas Instruments

TRSF3232ECDRG4 by Texas Instruments

TRSF3232ECDRG4 by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 16 terminals, and EIA-232 interface standard. It operates in commercial temperature grade from 0 to 70°C, ideal for data communication applications requiring high-speed signal transmission over short distances.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,960 parts In-Stock

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8,960

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Digiode

USA . 125 parts In-Stock

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125

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Nova Conductors

Japan . 18 parts In-Stock

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 299 parts In-Stock

1+ parts

$3.500

100+ parts

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299

$3.500

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Corohmni

South Africa . 93 parts In-Stock

1+ parts

$11.365

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93

$11.365

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Parana Technologies

USA . 361 parts In-Stock

1+ parts

$12.882

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$13.366

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361

$12.882

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$13.366

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ChromeModa Solutions

Germany . 2,476 parts In-Stock

1+ parts

$14.474

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$11.869

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2,476

$14.474

$11.869

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IDEA Electronic Components Group

UK . 2,136 parts In-Stock

1+ parts

$14.474

100+ parts

$13.750

1k+ parts

$13.027

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2,136

$14.474

$13.750

$13.027

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AZTECH Wire

Italy . 384 parts In-Stock

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$18.115

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384

$18.115

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Ampacity Inc.

Singapore . 781 parts In-Stock

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$35.500

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781

$35.500

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Corphita

USA . 4,763 parts In-Stock

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DigiPath Technology Company

USA . 1,729 parts In-Stock

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$13.050

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1,729

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$13.050

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Argo Parts USA

USA . 1,171 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 531 parts In-Stock

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531

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Overview

Experience unparalleled quality and reliability with the TRSF3232ECDRG4 by Texas Instruments, a leading manufacturer in the industry. As part of the Line Drivers & Receivers category, this product offers exceptional value and benefits to customers. With its high-performance functionality and innovative design, it is ideal for various applications. Trust in Texas Instruments for cutting-edge technology that delivers superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for various applications.

Surface Mount: YES

Saves space on PCB and allows for efficient assembly.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

No. of Functions: 2

Can perform multiple functions in a single package, saving on board space.

Package Shape: RECTANGULAR

Standard shape for easy integration into designs.

Power Supplies (V): 3.3/5

Compatible with common power supplies, easy to integrate into existing systems.

No. of Terminals: 16

Sufficient number of terminals for connections and functionality.

Package Style (Meter): SMALL OUTLINE

Compact size for space-constrained applications.

Maximum High Level Input Current: 0.000001 Amp

Low power consumption for energy efficiency.

Minimum Supply Voltage: 3 V

Wide operating voltage range for compatibility with different systems.

Maximum Operating Temperature: 70 °C

Can operate in a wide range of temperature environments.

Minimum Operating Temperature: 0 °C

Can withstand cold temperatures for outdoor or industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Corrosion-resistant finish for long-lasting performance.

Terminal Position: DUAL

Allows for flexibility in connection options.

Maximum Seated Height: 1.75 mm

Low profile for compact designs.

Width: 3.9 mm

Compact width for space-saving on PCB.

Maximum Output Low Current: 1.6 Amp

Can drive high current output loads.

Receiver No. of Bits: 2

Suitable for applications requiring 2-bit receiver functionality.

Maximum Time At Peak Reflow Temperature (s): 30

Easy to solder during manufacturing.

Peak Reflow Temperature °C: 260

Can withstand high temperature soldering processes.

Length: 9.9 mm

Compact length for space-saving on PCB.

Minimum Out Swing: 10 V

Good signal swing for reliable communication.

Temperature Grade: COMMERCIAL

Suitable for commercial applications.

Maximum Receive Delay: 0 ns

Minimal delay for real-time operation.

Terminal Form: GULL WING

Easy to solder onto PCB.

Interface Standard: EIA-232

Compatible with EIA-232 interface for standardized communication.

Maximum Supply Current: 1 mA

Low power consumption for energy efficiency.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input for noise immunity and reliable operation.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for easy integration.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common connectors.

Driver No. of Bits: 2

Suitable for applications requiring 2-bit driver functionality.

Interface IC Type: LINE TRANSCEIVER

Specific IC type for line driver and receiver functions.

Technical Specifications

Line Drivers & Receivers TRSF3232ECDRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TRSF3232ECDRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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