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TPS70745PWPR

Texas Instruments

TPS70745PWPR by Texas Instruments

TPS70745PWPR by Texas Instruments is a Power Management IC with 20 terminals, suitable for automotive applications. It operates b/w -40 to 125°C, supporting a supply voltage range of 2.7V to 6V. This IC features a small outline package style and gull wing terminal form for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,981 parts In-Stock

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2,981

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Vyrian

USA . 1,997 parts In-Stock

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1,997

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Distributors (Availability)

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Semicontronic

India . 1,080 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

-

1,080

$5.500

$5.362

$5.335

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Ampacity Inc.

Singapore . 1,282 parts In-Stock

1+ parts

$6.500

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1,282

$6.500

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One Stop Electronics

USA . 1,158 parts In-Stock

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$7.500

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1,158

$7.500

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AZTECH Wire

Italy . 588 parts In-Stock

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$9.507

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588

$9.507

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Parana Technologies

USA . 2,355 parts In-Stock

1+ parts

$10.621

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$11.114

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2,355

$10.621

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$11.114

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DigiPath Technology Company

USA . 1,845 parts In-Stock

1+ parts

$11.695

100+ parts

$10.760

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1,845

$11.695

$10.760

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IDEA Electronic Components Group

UK . 1,706 parts In-Stock

1+ parts

$11.934

100+ parts

$11.337

1k+ parts

$10.741

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1,706

$11.934

$11.337

$10.741

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ChromeModa Solutions

Germany . 298 parts In-Stock

1+ parts

$11.934

100+ parts

$9.786

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298

$11.934

$9.786

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Corphita

USA . 848 parts In-Stock

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848

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Microchip USA

USA . 218 parts In-Stock

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Corohmni

South Africa . 146 parts In-Stock

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Overview

Discover the power of reliability with Texas Instruments' TPS70745PWPR Power Management IC. Designed for automotive-grade applications, this high-quality IC offers unmatched performance and efficiency. With a compact design and dual terminal position, this IC is perfect for a wide range of power supply support circuits. Trust Texas Instruments to provide top-of-the-line solutions for all your power management needs. Choose the TPS70745PWPR for exceptional quality and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in power management ICs due to its good thermal properties and durability.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, making the product cost-effective.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various PCB layouts and designs.

No. of Terminals: 20

Having a higher number of terminals provides more connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in a wide range of operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes the product suitable for use in extreme temperature environments.

Width (mm): 4.4 mm

The compact width allows for space-saving design and integration in small electronic devices.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means the product meets stringent quality and reliability standards required for automotive applications.

No. of Channels: 2

Having multiple channels allows for more power management options and increased functionality.

Technical Specifications

Power Management ICs TPS70745PWPR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

MANUAL RESET INPUT; POWER ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

TPS70745PWPR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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