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TPS6590375ZWST

Texas Instruments

TPS6590375ZWST by Texas Instruments

TPS6590375ZWST by Texas Instruments is a Power Management IC with 169 terminals, operating at -40 to 125 °C. It features a nominal voltage of 3.8 V and is suitable for automotive applications due to its low profile grid array package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,868 parts In-Stock

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Digiode

USA . 351 parts In-Stock

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Semicontronic

India . 863 parts In-Stock

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$1.500

100+ parts

$1.462

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$1.455

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863

$1.500

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$1.455

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Parana Technologies

USA . 1,421 parts In-Stock

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$1.744

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$2.321

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ChromeModa Solutions

Germany . 3,059 parts In-Stock

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$1.960

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$1.607

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$1.960

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IDEA Electronic Components Group

UK . 1,396 parts In-Stock

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$1.960

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$1.764

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One Stop Electronics

USA . 1,224 parts In-Stock

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$2.500

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AZTECH Wire

Italy . 691 parts In-Stock

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Component Stockers USA

USA . 471 parts In-Stock

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$99.990

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Corphita

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DigiPath Technology Company

USA . 1,344 parts In-Stock

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Corohmni

South Africa . 408 parts In-Stock

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Overview

Elevate your power management game with the TPS6590375ZWST by Texas Instruments. Designed with top-notch quality and reliability that only a trusted manufacturer like Texas Instruments can provide, this Power Management IC is perfect for a wide range of applications. With its advanced features and exceptional performance, this product offers unmatched value, benefits, and advantages to customers. Say goodbye to power management issues and hello to seamless operation with the TPS6590375ZWST.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and durability, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on the circuit board.

Nominal Supply Voltage (Vsup): 3.8 V

Operating at a stable nominal supply voltage of 3.8 V ensures consistent performance and power efficiency.

No. of Terminals: 169

Having a large number of terminals allows for multiple connections and functionalities, making the product versatile.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at a low minimum temperature of -40°C ensures functionality in a wide range of temperature environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of Tin Silver Copper provides excellent conductivity and corrosion resistance for reliable connections.

Width (mm): 12 mm

Compact width of 12 mm allows for easy integration into different electronic devices and layouts.

Minimum Supply Voltage (Vsup): 3.135 V

The ability to operate at a minimum supply voltage of 3.135 V ensures flexibility and compatibility with various power sources.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets strict temperature and performance requirements for automotive systems.

No. of Channels: 14

Having 14 channels allows for multiple power management functions to be controlled independently, increasing efficiency and customization.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8 mm provides precise connections and layout options for complex circuit designs.

Maximum Supply Voltage (Vsup): 5.25 V

Support for a maximum supply voltage of 5.25 V allows for compatibility with a wide range of power sources and applications.

Adjustable Threshold: YES

The ability to adjust the threshold levels makes the product versatile and customizable for different power management requirements.

Technical Specifications

Power Management ICs TPS6590375ZWST attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

14

No. of Functions:

1

No. of Terminals:

169

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

12 mm

Trade Compliance

TPS6590375ZWST Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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