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TPS65020RHARG4

Texas Instruments

TPS65020RHARG4 by Texas Instruments

TPS65020RHARG4 by Texas Instruments is a 40-terminal Power Management IC with a supply voltage of 3.6V and max output voltage of 6V. It features a max switching frequency of 1700 kHz, suitable for industrial applications requiring power supply management circuits in compact spaces.

Median Price

$6.720

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 8 parts In-Stock

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$6.720

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Vyrian

USA . 5,864 parts In-Stock

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Digiode

USA . 2,379 parts In-Stock

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Zilex Electronics Inc.

Canada . 514 parts In-Stock

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Connector Distribution Corp

USA . 240 parts In-Stock

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240

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Right Parts Inc.

USA . 240 parts In-Stock

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240

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Microfarads

USA . 8 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,426 parts In-Stock

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$6.500

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Parana Technologies

USA . 1,859 parts In-Stock

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$16.420

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$16.715

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AZTECH Wire

Italy . 688 parts In-Stock

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$17.033

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DigiPath Technology Company

USA . 778 parts In-Stock

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$18.080

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$16.634

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ChromeModa Solutions

Germany . 5,281 parts In-Stock

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$18.449

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$15.128

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IDEA Electronic Components Group

UK . 496 parts In-Stock

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$18.449

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$17.527

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$16.604

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496

$18.449

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Component Stockers USA

USA . 402 parts In-Stock

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$99.990

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Microchip USA

USA . 3,946 parts In-Stock

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Corphita

USA . 2,759 parts In-Stock

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Overview

Enhance your power management systems with the TPS65020RHARG4 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge Power Management ICs that provide seamless integration and superior performance. With its versatile applications and compact design, this chip carrier is perfect for industrial settings where precision and efficiency are crucial. Trust in Texas Instruments to deliver the value, benefits, and advantages you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mount enables easy and efficient manufacturing processes, saving time and cost.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6 V ensures compatibility with a wide range of devices and systems.

No. of Terminals: 40

With 40 terminals, the product offers versatile connectivity options for different circuit configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in extreme conditions.

Minimum Output Voltage: 0.6 V

The minimum output voltage of 0.6 V allows for precise power regulation and control.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures functionality in cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity and corrosion resistance for stable connections.

Maximum Output Voltage: 6 V

The high maximum output voltage of 6 V allows for powering a wide range of devices and components.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm allows for compact and space-saving designs.

Maximum Switching Frequency: 1700 kHz

The high maximum switching frequency of 1700 kHz enables fast and efficient power management operations.

Maximum Output Current: 1.2 A

The high maximum output current of 1.2 A ensures sufficient power delivery for demanding applications.

Technical Specifications

Power Management ICs TPS65020RHARG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Outputs:

6

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.2 A

Maximum Output Voltage:

6 V

Minimum Output Voltage:

.6 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.033 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Maximum Switching Frequency:

1700 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

6 mm

Trade Compliance

TPS65020RHARG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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