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TPS3838E18QDBVRQ1

Texas Instruments

TPS3838E18QDBVRQ1 by Texas Instruments

TPS3838E18QDBVRQ1 by Texas Instruments is a Power Management IC with 1.8V supply voltage, AEC-Q100 screening level, and -40 to 125°C operating temperature range. Ideal for automotive applications due to its small outline package style and nickel palladium gold terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,786 parts In-Stock

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Vyrian

USA . 1,547 parts In-Stock

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Nova Conductors

Japan . 49 parts In-Stock

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49

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One Stop Electronics

USA . 1,339 parts In-Stock

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$0.500

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$0.500

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Parana Technologies

USA . 345 parts In-Stock

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$1.213

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$2.004

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345

$1.213

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$2.004

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DigiPath Technology Company

USA . 844 parts In-Stock

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$1.336

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$1.229

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844

$1.336

$1.229

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ChromeModa Solutions

Germany . 4,227 parts In-Stock

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$1.363

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$1.118

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$1.363

$1.118

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IDEA Electronic Components Group

UK . 308 parts In-Stock

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$1.363

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$1.227

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308

$1.363

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$1.227

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Ampacity Inc.

Singapore . 257 parts In-Stock

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$4.500

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257

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AZTECH Wire

Italy . 250 parts In-Stock

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$13.380

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Kepictronics

USA . 20,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,845 parts In-Stock

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Perfect Parts

USA . 7,179 parts In-Stock

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Continental Prestige Electronics

USA . 6,920 parts In-Stock

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Corphita

USA . 4,458 parts In-Stock

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Argo Parts USA

USA . 1,454 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Enhance your automotive power management system with the TPS3838E18QDBVRQ1 by Texas Instruments. Designed with top-quality materials and AEC-Q100 screening, this small outline, low-profile IC provides a reliable solution for various power supply support circuit applications. With a nominal supply voltage of 1.8V and a wide operating temperature range, this product offers exceptional performance in challenging environments. Trust Texas Instruments for cutting-edge technology that delivers value, efficiency, and peace of mind to customers looking for superior power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and allows for compact designs.

Surface Mount: YES

Surface mount capability makes it easy to integrate into PCB designs.

Screening Level: AEC-Q100

AEC-Q100 automotive screening ensures high reliability and quality for automotive applications.

Nominal Supply Voltage (Vsup): 1.8 V

Suitable nominal supply voltage for power management applications.

Power Supplies (V): 1.8

Designed for power supply support circuit with 1.8V power supply.

No. of Terminals: 5

Simplified connectivity with just 5 terminals.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact package style with low profile for space-constrained applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, suitable for automotive and industrial use.

Terminal Finish: NICKEL PALLADIUM GOLD

Terminal finish provides corrosion resistance and ensures good electrical conductivity.

Nominal Threshold Voltage (V): +1.71V

Optimal threshold voltage for precise power management.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature and reliability.

Maximum Supply Current (Isup): 0.025 mA

Low supply current for energy-efficient operation.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and mounting.

Terminal Pitch: 0.95 mm

Narrow terminal pitch for compact PCB layouts.

Maximum Supply Voltage (Vsup): 6 V

Supports a wide range of supply voltages up to 6V for flexibility in power management applications.

Technical Specifications

Power Management ICs TPS3838E18QDBVRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 1.71V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.71V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TPS3838E18QDBVRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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