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TPS3824-30DBVRG4

Texas Instruments

TPS3824-30DBVRG4 by Texas Instruments

TPS3824-30DBVRG4 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 2.5/5V power supplies, and 1.1V min supply voltage. It is ideal for industrial applications requiring a small outline, low profile package with dual terminal position and CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Vyrian

USA . 5,633 parts In-Stock

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5,633

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Digiode

USA . 1,599 parts In-Stock

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1,599

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 774 parts In-Stock

1+ parts

$1.500

100+ parts

-

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774

$1.500

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Semicontronic

India . 1,648 parts In-Stock

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$5.500

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$5.362

1k+ parts

$5.335

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1,648

$5.500

$5.362

$5.335

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Ampacity Inc.

Singapore . 262 parts In-Stock

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$7.500

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262

$7.500

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AZTECH Wire

Italy . 631 parts In-Stock

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$14.782

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631

$14.782

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Parana Technologies

USA . 968 parts In-Stock

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$20.305

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$20.313

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968

$20.305

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$20.313

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DigiPath Technology Company

USA . 1,036 parts In-Stock

1+ parts

$22.359

100+ parts

$20.570

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1,036

$22.359

$20.570

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IDEA Electronic Components Group

UK . 1,424 parts In-Stock

1+ parts

$22.815

100+ parts

$21.674

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$20.534

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1,424

$22.815

$21.674

$20.534

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ChromeModa Solutions

Germany . 26 parts In-Stock

1+ parts

$22.815

100+ parts

$18.708

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26

$22.815

$18.708

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A-Z Elektronik GmbH

Germany . 8,717 parts In-Stock

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8,717

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Kepictronics

USA . 3,000 parts In-Stock

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Microchip USA

USA . 1,300 parts In-Stock

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Corohmni

South Africa . 475 parts In-Stock

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475

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Corphita

USA . 398 parts In-Stock

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398

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Overview

Discover the TPS3824-30DBVRG4 by Texas Instruments, a top-of-the-line Power Management IC that promises unrivaled quality and reliability. Designed with cutting-edge technology and precision engineering, this product offers seamless power management solutions for a wide range of applications. With Texas Instruments' reputable name backing it up, customers can trust in the superior performance and durability of this small yet powerful device. Experience the efficiency and convenience that the TPS3824-30DBVRG4 brings to your projects, making it an essential component for your electronic systems. Elevate your designs with this exceptional Power Management IC today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for long-term use.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V nominal supply voltage is common and compatible with many devices, making this product versatile.

No. of Terminals: 5

Having 5 terminals allows for easy connectivity and integration with various circuits.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperature conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency of this power management IC.

Technical Specifications

Power Management ICs TPS3824-30DBVRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.63V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.63V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TPS3824-30DBVRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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