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TPS3813L30DBVRG4

Texas Instruments

TPS3813L30DBVRG4 by Texas Instruments

TPS3813L30DBVRG4 by Texas Instruments is a Power Management IC with 3V nominal voltage. It has 6 terminals, operates b/w -40 to 85°C, and supports power supplies from 2V to 6V. This IC is ideal for industrial applications requiring low profile and small outline packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,031 parts In-Stock

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Digiode

USA . 129 parts In-Stock

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129

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One Stop Electronics

USA . 789 parts In-Stock

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$0.500

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789

$0.500

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Semicontronic

India . 226 parts In-Stock

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$0.500

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$0.488

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$0.485

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226

$0.500

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$0.485

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Ampacity Inc.

Singapore . 1,403 parts In-Stock

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$3.500

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$3.500

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Parana Technologies

USA . 972 parts In-Stock

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$4.304

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$4.728

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972

$4.304

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$4.728

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IDEA Electronic Components Group

UK . 1,526 parts In-Stock

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$4.836

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$4.352

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1,526

$4.836

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$4.352

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ChromeModa Solutions

Germany . 1,495 parts In-Stock

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$4.836

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$3.966

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1,495

$4.836

$3.966

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AZTECH Wire

Italy . 813 parts In-Stock

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$12.928

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813

$12.928

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Kepictronics

USA . 6,866 parts In-Stock

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Microchip USA

USA . 2,872 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,060 parts In-Stock

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Corphita

USA . 1,150 parts In-Stock

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Corohmni

South Africa . 288 parts In-Stock

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DigiPath Technology Company

USA . 3 parts In-Stock

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$4.360

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$4.360

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Overview

Discover the power of reliable and efficient power management with the TPS3813L30DBVRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that guarantee superior performance and longevity. Designed for a wide range of applications, this small outline, low profile package offers customers the peace of mind knowing their devices are powered by a trusted name in the industry. Experience the benefits of seamless power supply management with the TPS3813L30DBVRG4 and elevate your products to new heights of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying production processes.

Nominal Supply Voltage (Vsup): 3 V

The nominal supply voltage of 3V is suitable for various applications, providing a stable power source for the connected devices.

Power Supplies (V): 2/6

The product supports a range of power supplies from 2V to 6V, making it versatile and compatible with different voltage requirements.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments, ensuring reliable performance under stress.

Minimum Operating Temperature: -40 °C

The product can operate at low temperatures down to -40°C, making it suitable for use in a wide range of environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity and corrosion resistance, ensuring a reliable connection over time.

Width (mm): 1.6 mm

The compact width of 1.6mm saves space on the PCB, making it suitable for applications with limited board real estate.

Minimum Supply Voltage (Vsup): 2 V

The product can operate at a minimum supply voltage of 2V, providing flexibility in power input options for different devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures that the product can perform reliably in rugged industrial environments with varying temperature conditions.

Technical Specifications

Power Management ICs TPS3813L30DBVRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.64V; POWER ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.64V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TPS3813L30DBVRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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