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TPS3801L30DCKRG4

Texas Instruments

TPS3801L30DCKRG4 by Texas Instruments

TPS3801L30DCKRG4 by Texas Instruments is a Power Management IC with a nominal voltage of 3.3V and min operating temperature of -40°C. It features a small outline package style, suitable for industrial applications requiring power supply support circuits. With a max seated height of 1.1mm and terminal pitch of 0.65mm, it offers reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,133 parts In-Stock

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8,133

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Digiode

USA . 4,644 parts In-Stock

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4,644

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 498 parts In-Stock

1+ parts

$0.500

100+ parts

-

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498

$0.500

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Parana Technologies

USA . 1,218 parts In-Stock

1+ parts

$1.185

100+ parts

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$1.988

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1,218

$1.185

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$1.988

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DigiPath Technology Company

USA . 519 parts In-Stock

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$1.305

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$1.201

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519

$1.305

$1.201

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ChromeModa Solutions

Germany . 2,794 parts In-Stock

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$1.332

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$1.092

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2,794

$1.332

$1.092

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IDEA Electronic Components Group

UK . 564 parts In-Stock

1+ parts

$1.332

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$1.199

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564

$1.332

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$1.199

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Corohmni

South Africa . 1,125 parts In-Stock

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$4.964

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$4.964

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One Stop Electronics

USA . 422 parts In-Stock

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$7.500

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422

$7.500

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AZTECH Wire

Italy . 856 parts In-Stock

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$18.364

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856

$18.364

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Corphita

USA . 4,612 parts In-Stock

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Microchip USA

USA . 4,438 parts In-Stock

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Argo Parts USA

USA . 4,003 parts In-Stock

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Continental Prestige Electronics

USA . 3,308 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Discover the innovative TPS3801L30DCKRG4 by Texas Instruments, a top-of-the-line Power Management IC designed to exceed your expectations. With a reputation for excellence, Texas Instruments ensures unparalleled quality and reliability in all their products. This compact and efficient IC is perfect for a wide range of applications, offering customers unmatched value, benefits, and advantages. Trust Texas Instruments to power your devices with cutting-edge technology and superior performance. Elevate your projects with the TPS3801L30DCKRG4 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and secure mounting onto PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 3.3 V

Optimal voltage level for efficient power management and compatibility with a wide range of devices.

Maximum Operating Temperature: 85 °C

Ensures stability and reliability even in high-temperature environments, increasing the product's overall lifespan.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient power management.

Technical Specifications

Power Management ICs TPS3801L30DCKRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.64 V; POWER ON RESET GENERATOR; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.64V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

TPS3801L30DCKRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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