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TPS3779DDBVR

Texas Instruments

TPS3779DDBVR by Texas Instruments

TPS3779DDBVR by Texas Instruments is a Power Management IC with 6 terminals, operating b/w -40 to 125 °C. It has a nominal voltage of 3.3V and can support power supply circuits in automotive applications. The package is small outline, low profile, with shrink pitch, making it suitable for surface mount designs.

Median Price

$1.534

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

$0.640

100+ parts

$0.630

1k+ parts

$0.610

10k+ parts

-

500

$0.640

$0.630

$0.610

-

Texas Instruments

USA . 42,244 parts In-Stock

1+ parts

$1.268

100+ parts

$1.047

1k+ parts

$0.566

10k+ parts

-

42,244

$1.268

$1.047

$0.566

-

DigiKey

USA . 2,988 parts In-Stock

1+ parts

$1.800

100+ parts

$1.069

1k+ parts

$0.938

10k+ parts

$0.872

2,988

$1.800

$1.069

$0.938

$0.872

Mouser Electronics

USA . 302 parts In-Stock

1+ parts

$1.800

100+ parts

$1.070

1k+ parts

$0.939

10k+ parts

$0.881

302

$1.800

$1.070

$0.939

$0.881

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,044 parts In-Stock

1+ parts

$0.747

100+ parts

-

1k+ parts

-

10k+ parts

-

2,044

$0.747

-

-

-

Vyrian

USA . 7,707 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,707

-

-

-

-

Bristol Electronics

USA . 2,984 parts In-Stock

1+ parts

-

100+ parts

$1.134

1k+ parts

$0.635

10k+ parts

$0.599

2,984

-

$1.134

$0.635

$0.599

Dan-Mar Components

USA . 2,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,984

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,526 parts In-Stock

1+ parts

$0.707

100+ parts

-

1k+ parts

-

10k+ parts

-

4,526

$0.707

-

-

-

Component Stockers USA

USA . 1,381 parts In-Stock

1+ parts

$0.800

100+ parts

$0.750

1k+ parts

-

10k+ parts

-

1,381

$0.800

$0.750

-

-

Parana Technologies

USA . 450 parts In-Stock

1+ parts

$10.498

100+ parts

-

1k+ parts

$11.011

10k+ parts

-

450

$10.498

-

$11.011

-

ChromeModa Solutions

Germany . 2,981 parts In-Stock

1+ parts

$11.796

100+ parts

$9.673

1k+ parts

-

10k+ parts

-

2,981

$11.796

$9.673

-

-

IDEA Electronic Components Group

UK . 152 parts In-Stock

1+ parts

$11.796

100+ parts

$11.206

1k+ parts

$10.616

10k+ parts

-

152

$11.796

$11.206

$10.616

-

DigiPath Technology Company

USA . 1,139 parts In-Stock

1+ parts

-

100+ parts

$10.635

1k+ parts

-

10k+ parts

-

1,139

-

$10.635

-

-

Overview

Experience unparalleled reliability and efficiency with the TPS3779DDBVR by Texas Instruments, a leading name in Power Management ICs. This small outline, low profile package offers dual channels for optimal performance in automotive applications. With an adjustable threshold voltage and a wide supply voltage range, this power supply support circuit provides flexibility and robust protection against voltage fluctuations. Trust in Texas Instruments to deliver cutting-edge technology that enhances your systems' performance and durability. Elevate your projects with the TPS3779DDBVR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the Power Management IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 3.3 V

Ideal voltage for various electronic devices, offering a stable power supply.

No. of Terminals: 6

Sufficient number of terminals for connecting to other components in the circuit.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial or automotive applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments without impact on performance.

Width (mm): 1.6 mm

Small width enables compact design and space-saving on the PCB.

Minimum Supply Voltage (Vsup): 1.5 V

Can operate at low voltages, suitable for battery-powered devices.

Temperature Grade: AUTOMOTIVE

Designed to meet specific automotive industry standards and requirements for reliability and performance in vehicles.

Maximum Supply Current (Isup): 0.0065 mA

Low power consumption helps in reducing energy usage and heat dissipation.

Technical Specifications

Power Management ICs TPS3779DDBVR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

THRESHOLD VOLTAGE IS 0V TO 6.5V

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Maximum Supply Current (Isup):

.0065 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.182V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TPS3779DDBVR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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