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TPS3128E18DBVTG4

Texas Instruments

TPS3128E18DBVTG4 by Texas Instruments

TPS3128E18DBVTG4 by Texas Instruments is a Power Management IC with 1.8V supply voltage, 5 terminals, and industrial temperature grade. It is used in power supply management circuits for applications requiring a compact rectangular package with surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,389 parts In-Stock

1+ parts

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5,389

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Digiode

USA . 1,680 parts In-Stock

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1,680

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Chip Stock

USA . 815 parts In-Stock

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815

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 225 parts In-Stock

1+ parts

$0.500

100+ parts

-

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225

$0.500

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Semicontronic

India . 1,145 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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1,145

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 668 parts In-Stock

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$6.500

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668

$6.500

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AZTECH Wire

Italy . 297 parts In-Stock

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$13.785

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297

$13.785

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Parana Technologies

USA . 418 parts In-Stock

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$17.707

100+ parts

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$17.890

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418

$17.707

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$17.890

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DigiPath Technology Company

USA . 896 parts In-Stock

1+ parts

$19.497

100+ parts

$17.937

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896

$19.497

$17.937

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ChromeModa Solutions

Germany . 4,373 parts In-Stock

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$19.895

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$16.314

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4,373

$19.895

$16.314

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IDEA Electronic Components Group

UK . 1,093 parts In-Stock

1+ parts

$19.895

100+ parts

$18.900

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$17.906

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1,093

$19.895

$18.900

$17.906

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Component Stockers USA

USA . 548 parts In-Stock

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$99.990

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548

$99.990

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Corphita

USA . 4,139 parts In-Stock

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4,139

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Microchip USA

USA . 955 parts In-Stock

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Corohmni

South Africa . 458 parts In-Stock

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458

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the TPS3128E18DBVTG4 Power Management IC. This versatile component, ideal for a wide range of applications, offers customers exceptional value and benefits. With a compact design and advanced features, this product provides efficient power management solutions that meet the highest industry standards. Trust Texas Instruments for cutting-edge technology and superior performance in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, making the product easy to handle and transport.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 1.8 V

Optimal supply voltage for stable and efficient power management.

No. of Terminals: 5

Simplified connectivity with minimal terminals for streamlined installation.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliability in various operating conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature environments without performance degradation.

Length: 2.9 mm

Compact size for space-efficient design and installation.

Nominal Threshold Voltage (V): +1.71V

Precise threshold voltage for accurate power management control.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where temperature fluctuation is common.

Maximum Supply Current (Isup): 0.03 mA

Low power consumption for energy-efficient operation.

Technical Specifications

Power Management ICs TPS3128E18DBVTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

MANUAL RESET INPUT; POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.03 mA

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

.75 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.71V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

TPS3128E18DBVTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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