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TPS2551DRVTG4

Texas Instruments

TPS2551DRVTG4 by Texas Instruments

TPS2551DRVTG4 by Texas Instruments is a Power Management IC with 3.3V supply voltage, adjustable threshold, and industrial temperature grade. It comes in a small outline package suitable for power supply support circuits. With surface mount capability and dual terminals, it operates b/w -40 to 85°C for various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,242 parts In-Stock

1+ parts

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5,242

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Digiode

USA . 4,839 parts In-Stock

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4,839

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Distributors (Availability)

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Semicontronic

India . 1,240 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

-

1,240

$5.500

$5.362

$5.335

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Ampacity Inc.

Singapore . 517 parts In-Stock

1+ parts

$5.500

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517

$5.500

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One Stop Electronics

USA . 501 parts In-Stock

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$5.500

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501

$5.500

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AZTECH Wire

Italy . 794 parts In-Stock

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$8.745

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794

$8.745

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Parana Technologies

USA . 461 parts In-Stock

1+ parts

$19.581

100+ parts

$1,818.383

1k+ parts

$17.623

10k+ parts

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461

$19.581

$1,818.383

$17.623

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DigiPath Technology Company

USA . 1,445 parts In-Stock

1+ parts

$21.561

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1,445

$21.561

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ChromeModa Solutions

Germany . 3,677 parts In-Stock

1+ parts

$22.001

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$18.041

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3,677

$22.001

$18.041

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IDEA Electronic Components Group

UK . 1,353 parts In-Stock

1+ parts

$22.001

100+ parts

$20.901

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$19.801

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1,353

$22.001

$20.901

$19.801

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Corphita

USA . 2,727 parts In-Stock

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2,727

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Microchip USA

USA . 2,276 parts In-Stock

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2,276

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Corohmni

South Africa . 460 parts In-Stock

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460

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Overview

Power up your devices with the TPS2551DRVTG4 by Texas Instruments, a top-notch Power Management IC that guarantees quality and reliability. Manufactured by Texas Instruments, a renowned industry leader, this IC is designed to meet all your power management needs. With a wide range of applications in various industries, this IC offers exceptional value and benefits to customers. Say goodbye to power issues and hello to seamless performance with the TPS2551DRVTG4. Choose Texas Instruments for superior power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with a common supply voltage, making it suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring stable performance in various operating conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature environments, increasing the product's versatility.

Maximum Seated Height: 0.8 mm

Low profile design saves space and allows for compact device integration.

Minimum Supply Voltage (Vsup): 2.5 V

Supports a range of supply voltages, providing flexibility in power input options.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations and offer improved soldering reliability.

Technical Specifications

Power Management ICs TPS2551DRVTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

TPS2551DRVTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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