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TPS2550DRVR

Texas Instruments

TPS2550DRVR by Texas Instruments

TPS2550DRVR by Texas Instruments is a Power Management IC with 6 terminals, operating voltage range of 2.5V to 6.5V, and adjustable threshold feature. It comes in a small outline package suitable for industrial applications requiring precise power supply support circuits. With a max temperature of 85°C, it offers reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,330 parts In-Stock

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2,330

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Rebound Electronics

UK . 2,230 parts In-Stock

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2,230

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Vyrian

USA . 2,145 parts In-Stock

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2,145

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Chip Stock

USA . 938 parts In-Stock

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938

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Distributors (Availability)

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One Stop Electronics

USA . 1,453 parts In-Stock

1+ parts

$0.500

100+ parts

-

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1,453

$0.500

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Parana Technologies

USA . 1,304 parts In-Stock

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$8.304

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-

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$8.925

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1,304

$8.304

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$8.925

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DigiPath Technology Company

USA . 782 parts In-Stock

1+ parts

$9.143

100+ parts

$8.412

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782

$9.143

$8.412

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ChromeModa Solutions

Germany . 5,308 parts In-Stock

1+ parts

$9.330

100+ parts

$7.651

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5,308

$9.330

$7.651

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IDEA Electronic Components Group

UK . 1,601 parts In-Stock

1+ parts

$9.330

100+ parts

$8.864

1k+ parts

$8.397

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1,601

$9.330

$8.864

$8.397

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Microchip USA

USA . 443 parts In-Stock

1+ parts

$9.420

100+ parts

$9.400

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$9.400

10k+ parts

$9.370

443

$9.420

$9.400

$9.400

$9.370

AZTECH Wire

Italy . 596 parts In-Stock

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$11.947

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596

$11.947

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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A-Z Elektronik GmbH

Germany . 1,850 parts In-Stock

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1,850

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Corphita

USA . 1,753 parts In-Stock

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1,753

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Overview

Enhance the efficiency and reliability of your power management system with the TPS2550DRVR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that are essential for various applications. With a small outline and very thin profile package style, this product offers flexibility and ease of use. Experience the benefits of adjustable threshold and dual terminal position, providing precise control and optimal performance. Trust Texas Instruments to provide innovative solutions that meet your power supply support circuit needs. Upgrade your system today with the TPS2550DRVR for superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight construction of the product.

Surface Mount: YES

The surface mount feature enables easy installation and space-saving on PCBs.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is commonly used in various electronic applications, making it compatible with a wide range of devices.

No. of Terminals: 6

With 6 terminals, this power management IC provides sufficient connectivity options for interfacing with other components.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function effectively in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent conductivity and corrosion resistance for long-term reliability.

Width (mm): 2 mm

The compact width of 2mm makes the IC suitable for applications with space constraints.

Maximum Supply Voltage (Vsup): 6.5 V

The 6.5V maximum supply voltage provides flexibility in power input options for different operating conditions.

Adjustable Threshold: YES

The adjustable threshold feature allows customization of operational parameters based on specific requirements.

Technical Specifications

Power Management ICs TPS2550DRVR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

.15 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

TPS2550DRVR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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