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TPS2550DBVR

Texas Instruments

TPS2550DBVR by Texas Instruments

TPS2550DBVR by Texas Instruments is a Power Management IC with 6 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.5V to 6.5V and adjustable threshold feature. Ideal for industrial applications requiring low profile, small outline power supply support circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 16,130 parts In-Stock

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Vyrian

USA . 4,251 parts In-Stock

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4,251

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Digiode

USA . 2,759 parts In-Stock

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2,759

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Distributors (Availability)

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Semicontronic

India . 136 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

136

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 660 parts In-Stock

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$3.500

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660

$3.500

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One Stop Electronics

USA . 1,572 parts In-Stock

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$4.500

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1,572

$4.500

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Microchip USA

USA . 162 parts In-Stock

1+ parts

$9.360

100+ parts

$9.330

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$9.330

10k+ parts

$9.300

162

$9.360

$9.330

$9.330

$9.300

AZTECH Wire

Italy . 630 parts In-Stock

1+ parts

$11.573

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630

$11.573

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Parana Technologies

USA . 2,307 parts In-Stock

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$12.897

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$13.383

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2,307

$12.897

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$13.383

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ChromeModa Solutions

Germany . 3,725 parts In-Stock

1+ parts

$14.491

100+ parts

$11.883

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3,725

$14.491

$11.883

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IDEA Electronic Components Group

UK . 969 parts In-Stock

1+ parts

$14.491

100+ parts

$13.766

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$13.042

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969

$14.491

$13.766

$13.042

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A-Z Elektronik GmbH

Germany . 11,700 parts In-Stock

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11,700

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Kepictronics

USA . 6,965 parts In-Stock

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Corphita

USA . 3,115 parts In-Stock

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DigiPath Technology Company

USA . 1,491 parts In-Stock

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$13.065

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1,491

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$13.065

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Corohmni

South Africa . 174 parts In-Stock

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174

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Overview

Enhance your power management capabilities with the TPS2550DBVR by Texas Instruments. Manufactured with top-quality materials and advanced technology, this Power Management IC offers unmatched reliability and efficiency. Ideal for a wide range of applications, this product provides customers with the value and benefits they need to optimize their systems. Don't settle for less when you can have the best in power supply support circuits with the TPS2550DBVR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to heat, making it a good choice for power management ICs that may operate at high temperatures.

Nominal Supply Voltage (Vsup): 3.3 V

A common and stable supply voltage, ensuring compatibility with a wide range of devices.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this IC can withstand various environmental conditions, making it versatile for different applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this IC suitable for use in cold environments or during winter months.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Maximum Seated Height: 1.45 mm

A low profile design allows for compact integration into electronic devices with limited space, making it ideal for small form factor applications.

Width (mm): 1.6 mm

A narrow width enables efficient placement on a PCB, optimizing space and allowing for more components to be mounted in the same area.

Minimum Supply Voltage (Vsup): 2.5 V

With a low minimum supply voltage, this IC can operate efficiently even when the power source is limited or fluctuating.

Adjustable Threshold: YES

The ability to adjust the threshold voltage allows for customization and optimization of the IC's performance to meet specific application requirements.

Technical Specifications

Power Management ICs TPS2550DBVR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Maximum Supply Current (Isup):

.15 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TPS2550DBVR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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