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TPS2399DGKG4

Texas Instruments

TPS2399DGKG4 by Texas Instruments

TPS2399DGKG4 by Texas Instruments is a Power Management IC with -48V power supplies, 500A max output current, and adjustable threshold. It is used in industrial applications for power supply support circuits due to its small outline package style and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 7,840 parts In-Stock

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Digiode

USA . 3,816 parts In-Stock

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Vyrian

USA . 3,011 parts In-Stock

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3,011

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Semicontronic

India . 1,522 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

1,522

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 703 parts In-Stock

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$2.500

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703

$2.500

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One Stop Electronics

USA . 1,106 parts In-Stock

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$3.500

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1,106

$3.500

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AZTECH Wire

Italy . 782 parts In-Stock

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$19.138

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782

$19.138

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Parana Technologies

USA . 2,036 parts In-Stock

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$19.576

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$19.573

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2,036

$19.576

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$19.573

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DigiPath Technology Company

USA . 1,289 parts In-Stock

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$21.555

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1,289

$21.555

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ChromeModa Solutions

Germany . 5,576 parts In-Stock

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$21.995

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$18.036

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5,576

$21.995

$18.036

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IDEA Electronic Components Group

UK . 1,327 parts In-Stock

1+ parts

$21.995

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$20.895

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$19.796

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1,327

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$19.796

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Corphita

USA . 4,826 parts In-Stock

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Microchip USA

USA . 2,766 parts In-Stock

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Corohmni

South Africa . 85 parts In-Stock

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Overview

Discover the cutting-edge TPS2399DGKG4 by Texas Instruments, a high-quality Power Management IC that offers unparalleled reliability and efficiency. Ideal for a wide range of applications, this product provides exceptional value and benefits to customers looking for a top-tier solution for their power supply support circuit needs. With Texas Instruments' reputation for excellence in manufacturing, you can trust that the TPS2399DGKG4 will deliver outstanding performance, making it the perfect choice for your industrial projects. Elevate your design with this innovative IC and experience the advantages it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, ideal for applications where weight and cost are important factors.

Surface Mount: YES

This feature enables easy and efficient mounting on the PCB, saving space and simplifying the manufacturing process.

Power Supplies (V): -48

With a negative supply voltage of -48V, this Power Management IC is suitable for applications requiring a stable and reliable power source.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and options, enhancing flexibility in circuit design and functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the IC can withstand rigorous environmental conditions and maintain its performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C makes this IC suitable for use in cold environments without compromising its functionality.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of multiple finishes on terminals ensures good conductivity, corrosion resistance, and reliability in different operating conditions.

Maximum Output Current: 500 A

The high maximum output current capacity of 500A allows the IC to handle heavy loads and power requirements, making it versatile for various applications.

Technical Specifications

Power Management ICs TPS2399DGKG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

IT OPERATES FROM -36V TO -80V SUPPLY

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

Nominal Negative Supply Voltage (Vsup):

-48 V

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

500 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-48

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1.5 mA

Maximum Supply Voltage (Vsup):

-36 V

Minimum Supply Voltage (Vsup):

-80 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS2399DGKG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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