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TPS2376DG4

Texas Instruments

TPS2376DG4 by Texas Instruments

TPS2376DG4 by Texas Instruments is a Power Management IC with 8 terminals, operating at -40 to 85°C. It supports a nominal voltage of 48V and peak reflow temperature of 260°C. Widely used in industrial applications for power supply support circuits due to its small outline package and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,157 parts In-Stock

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3,157

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Vyrian

USA . 2,623 parts In-Stock

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2,623

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Distributors (Availability)

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One Stop Electronics

USA . 1,317 parts In-Stock

1+ parts

$1.500

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1,317

$1.500

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Semicontronic

India . 1,398 parts In-Stock

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$5.500

100+ parts

$5.362

1k+ parts

$5.335

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1,398

$5.500

$5.362

$5.335

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Parana Technologies

USA . 1,760 parts In-Stock

1+ parts

$5.880

100+ parts

-

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$6.664

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1,760

$5.880

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$6.664

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DigiPath Technology Company

USA . 1,704 parts In-Stock

1+ parts

$6.475

100+ parts

$5.957

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1,704

$6.475

$5.957

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Ampacity Inc.

Singapore . 1,621 parts In-Stock

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$6.500

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1,621

$6.500

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IDEA Electronic Components Group

UK . 1,620 parts In-Stock

1+ parts

$6.607

100+ parts

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$5.946

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1,620

$6.607

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$5.946

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ChromeModa Solutions

Germany . 1,092 parts In-Stock

1+ parts

$6.607

100+ parts

$5.418

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1,092

$6.607

$5.418

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AZTECH Wire

Italy . 434 parts In-Stock

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$16.039

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434

$16.039

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QUARKTWIN TECHNOLOGY LTD

USA . 28,450 parts In-Stock

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28,450

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Microchip USA

USA . 4,487 parts In-Stock

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Corphita

USA . 297 parts In-Stock

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Corohmni

South Africa . 174 parts In-Stock

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Overview

Unlock the power of efficient energy management with the TPS2376DG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that are versatile and reliable. This innovative product is designed to optimize performance and streamline operations, making it ideal for a wide range of applications. Trust in Texas Instruments to provide the tools you need to enhance your systems and maximize efficiency. Upgrade to the TPS2376DG4 today and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and lightweight, which is suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability makes it easier to integrate and mount the IC onto a circuit board, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 48 V

Operating at a nominal supply voltage of 48V, this IC is suitable for systems that require a stable power supply at this voltage level.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in saving space on the PCB, making it ideal for compact designs where space is a constraint.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures down to -40°C ensures reliability and functionality even in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability and performance.

Width (mm): 3.9 mm

Compact width of 3.9mm allows for easy integration into tight spaces or small form factor devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically as a power supply support circuit, this IC helps in regulating and managing power efficiently for various applications.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this IC can withstand the soldering process during manufacturing without any adverse effects.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the IC can operate reliably in harsh industrial environments with temperature fluctuations.

Maximum Supply Current (Isup): 0.45 mA

Low maximum supply current of 0.45mA helps in reducing power consumption and improves efficiency in power management applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and secure solder joints during assembly, ensuring a reliable connection.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27mm enables easy soldering and placement on a PCB, allowing for efficient manufacturing processes.

Maximum Supply Voltage (Vsup): 57 V

With a maximum supply voltage of 57V, this IC can handle higher voltage inputs, providing flexibility for different power supply requirements.

Technical Specifications

Power Management ICs TPS2376DG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TPS2376DG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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