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TPS2376DDAR-HG4

Texas Instruments

TPS2376DDAR-HG4 by Texas Instruments

TPS2376DDAR-HG4 by Texas Instruments is a Power Management IC with 48V nominal voltage, suitable for industrial applications. It features a small outline package style, dual terminal position, and adjustable threshold. With a max operating temperature of 85°C and surface mount capability, it offers efficient power supply support in compact designs.

Median Price

$0.640

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,883 parts In-Stock

1+ parts

$0.640

100+ parts

$0.630

1k+ parts

$0.610

10k+ parts

-

5,883

$0.640

$0.630

$0.610

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,316 parts In-Stock

1+ parts

-

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-

1k+ parts

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4,316

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-

-

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Vyrian

USA . 4,194 parts In-Stock

1+ parts

-

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4,194

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-

-

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

-

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-

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150

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 234 parts In-Stock

1+ parts

$4.500

100+ parts

-

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-

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234

$4.500

-

-

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One Stop Electronics

USA . 680 parts In-Stock

1+ parts

$6.500

100+ parts

-

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-

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680

$6.500

-

-

-

Corohmni

South Africa . 1,104 parts In-Stock

1+ parts

$8.894

100+ parts

-

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1,104

$8.894

-

-

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Parana Technologies

USA . 350 parts In-Stock

1+ parts

$12.416

100+ parts

-

1k+ parts

$12.859

10k+ parts

-

350

$12.416

-

$12.859

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ChromeModa Solutions

Germany . 5,202 parts In-Stock

1+ parts

$13.951

100+ parts

$11.440

1k+ parts

-

10k+ parts

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5,202

$13.951

$11.440

-

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IDEA Electronic Components Group

UK . 1,085 parts In-Stock

1+ parts

$13.951

100+ parts

$13.253

1k+ parts

$12.556

10k+ parts

-

1,085

$13.951

$13.253

$12.556

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AZTECH Wire

Italy . 707 parts In-Stock

1+ parts

$17.349

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707

$17.349

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QUARKTWIN TECHNOLOGY LTD

USA . 23,253 parts In-Stock

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23,253

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A-Z Elektronik GmbH

Germany . 9,866 parts In-Stock

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Argo Parts USA

USA . 3,124 parts In-Stock

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Corphita

USA . 2,879 parts In-Stock

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2,879

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Metaverse IC Inc.

Canada . 2,800 parts In-Stock

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2,800

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Microchip USA

USA . 1,505 parts In-Stock

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1,505

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DigiPath Technology Company

USA . 1,415 parts In-Stock

1+ parts

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$12.578

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1,415

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$12.578

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Continental Prestige Electronics

USA . 961 parts In-Stock

1+ parts

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961

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Power up your projects with the TPS2376DDAR-HG4 from Texas Instruments, a leading manufacturer in power management ICs. This small outline, low profile package offers a nominal supply voltage of 48V, making it perfect for a variety of industrial applications. With nickel/palladium/gold terminal finish and dual terminal position, this IC ensures reliable performance in any environment. Trust Texas Instruments to deliver quality products that provide efficient power support for your designs. Experience the difference with the TPS2376DDAR-HG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on a circuit board, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 48 V

With a nominal supply voltage of 48 V, this power management IC is ideal for applications that require a stable power source at this voltage level.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the IC can withstand harsh environmental conditions and maintain reliable performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Width (mm): 3.9 mm

The compact width of 3.9 mm allows for space-saving installation in tight layouts or densely populated circuit boards.

Minimum Supply Voltage (Vsup): 0 V

The minimum supply voltage of 0 V ensures compatibility with a wide range of power sources, making the IC versatile for various applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that the IC is designed to operate reliably in demanding industrial environments with temperature fluctuations.

Adjustable Threshold: YES

The adjustable threshold feature allows users to customize the trigger points for different circuit operations, enhancing flexibility and control.

Technical Specifications

Power Management ICs TPS2376DDAR-HG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.89 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.68 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.6 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TPS2376DDAR-HG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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