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TPS2331IDRG4

Texas Instruments

TPS2331IDRG4 by Texas Instruments

TPS2331IDRG4 by Texas Instruments is a Power Management IC with 14 terminals, operating at -40 to 85°C. It supports supply voltages of 3-13V and has a max output current of 500A. Ideal for industrial applications requiring power supply support circuits in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,075 parts In-Stock

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Digiode

USA . 1,999 parts In-Stock

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1,999

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,028 parts In-Stock

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$2.500

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1,028

$2.500

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Semicontronic

India . 882 parts In-Stock

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$4.500

100+ parts

$4.388

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$4.365

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882

$4.500

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$4.365

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One Stop Electronics

USA . 162 parts In-Stock

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$5.500

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Parana Technologies

USA . 1,959 parts In-Stock

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$7.816

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$8.367

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1,959

$7.816

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DigiPath Technology Company

USA . 798 parts In-Stock

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$8.606

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$7.918

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798

$8.606

$7.918

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ChromeModa Solutions

Germany . 6,209 parts In-Stock

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$8.782

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$7.201

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$8.782

$7.201

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IDEA Electronic Components Group

UK . 296 parts In-Stock

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$8.782

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$8.343

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$7.904

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296

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$7.904

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AZTECH Wire

Italy . 298 parts In-Stock

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$12.294

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Microchip USA

USA . 2,734 parts In-Stock

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Corphita

USA . 2,322 parts In-Stock

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Corohmni

South Africa . 498 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the TPS2331IDRG4 by Texas Instruments, a leading manufacturer in Power Management ICs. This innovative product offers a wide range of applications with its small outline package style and adjustable threshold feature. With a nominal supply voltage of 4.5V and maximum output current of 500A, this power supply support circuit is designed to meet industrial-grade standards. Experience peace of mind knowing that your power management needs are taken care of efficiently and effectively with the TPS2331IDRG4. Elevate your projects to new heights with this top-notch solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 4.5 V

Ideal voltage level for power management, ensuring optimal performance and efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

Operates effectively in cold environments, making it versatile for use in various conditions.

Maximum Output Current: 500 A

Capable of handling high current loads, making it suitable for power-hungry devices or systems.

Adjustable Threshold: YES

Allows for customization and fine-tuning of the threshold levels, providing flexibility in power management settings.

Technical Specifications

Power Management ICs TPS2331IDRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

REQUIRES 3V TO 5.5V SUPPLY FOR CHANNEL 2

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

500 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,3/13

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

13 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2331IDRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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