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TPS2310IPWG4

Texas Instruments

TPS2310IPWG4 by Texas Instruments

TPS2310IPWG4 by Texas Instruments is a Power Management IC with 20 terminals, supporting supply voltages of 3.3/5V and 3/13V. It has a max output current of 500A and can operate in temperatures ranging from -40 to 85°C. Ideal for industrial applications requiring power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,444 parts In-Stock

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Digiode

USA . 1,329 parts In-Stock

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One Stop Electronics

USA . 1,462 parts In-Stock

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$1.500

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$1.500

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Ampacity Inc.

Singapore . 617 parts In-Stock

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$3.500

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617

$3.500

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Semicontronic

India . 1,564 parts In-Stock

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$4.500

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$4.388

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$4.365

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$4.500

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$4.365

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AZTECH Wire

Italy . 847 parts In-Stock

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$14.854

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847

$14.854

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Parana Technologies

USA . 1,247 parts In-Stock

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$20.426

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$20.473

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$20.426

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$20.473

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DigiPath Technology Company

USA . 1,954 parts In-Stock

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$22.491

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$22.491

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IDEA Electronic Components Group

UK . 1,517 parts In-Stock

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$22.950

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$21.802

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$20.655

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1,517

$22.950

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$20.655

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ChromeModa Solutions

Germany . 599 parts In-Stock

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$22.950

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$18.819

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599

$22.950

$18.819

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Corphita

USA . 2,124 parts In-Stock

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Microchip USA

USA . 1,938 parts In-Stock

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Corohmni

South Africa . 399 parts In-Stock

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Overview

Elevate your power management game with the TPS2310IPWG4 by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Designed for a wide range of applications, this small outline, thin profile package delivers efficient performance with an adjustable threshold feature. With dual terminals and a maximum output current of 500A, this industrial-grade IC maximizes functionality while maintaining a compact size. Trust Texas Instruments to provide you with cutting-edge technology that brings value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost.

Nominal Supply Voltage (Vsup): 4.5 V

The 4.5V supply voltage is common and widely compatible with various systems and applications.

No. of Terminals: 20

Having 20 terminals provides flexibility in connectivity options and functionality.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish ensures good conductivity and corrosion resistance for a longer lifespan.

Maximum Output Current: 500 A

The high maximum output current allows for powering multiple components or devices without overload issues.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can endure the reflow soldering process during manufacturing without damage.

Technical Specifications

Power Management ICs TPS2310IPWG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

REQUIRES 3V TO 5.5V SUPPLY FOR CHANNEL 2

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

500 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,3/13

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

13 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

TPS2310IPWG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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