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TPS22942DCKRG4

Texas Instruments

TPS22942DCKRG4 by Texas Instruments

TPS22942DCKRG4 by Texas Instruments is a Power Management IC with 1.8V nominal voltage, -40 to 85°C operating temperature range, and 5 terminals in a small outline package. Ideal for industrial applications requiring power supply support circuits due to its compact size and low supply current of 0.08mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,040 parts In-Stock

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Digiode

USA . 4,396 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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One Stop Electronics

USA . 385 parts In-Stock

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$1.500

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385

$1.500

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Ampacity Inc.

Singapore . 1,030 parts In-Stock

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$4.500

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$4.500

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Parana Technologies

USA . 267 parts In-Stock

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$9.467

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$10.078

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267

$9.467

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$10.078

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ChromeModa Solutions

Germany . 6,740 parts In-Stock

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$10.637

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$8.722

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$10.637

$8.722

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IDEA Electronic Components Group

UK . 948 parts In-Stock

1+ parts

$10.637

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$10.105

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$9.573

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948

$10.637

$10.105

$9.573

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AZTECH Wire

Italy . 579 parts In-Stock

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$12.308

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Argo Parts USA

USA . 4,854 parts In-Stock

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Corphita

USA . 3,224 parts In-Stock

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Continental Prestige Electronics

USA . 2,962 parts In-Stock

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Microchip USA

USA . 2,352 parts In-Stock

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DigiPath Technology Company

USA . 2,307 parts In-Stock

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$9.590

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$9.590

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Bastille Electronics

Australia . 62 parts In-Stock

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Overview

Enhance the efficiency and reliability of your power management systems with the TPS22942DCKRG4 by Texas Instruments. Crafted with top-quality materials and cutting-edge technology, this Power Management IC offers unparalleled performance in a compact and durable package. Ideal for a wide range of applications, from consumer electronics to industrial systems, this product delivers precise and consistent power supply support. Trust Texas Instruments for superior products that provide value, benefits, and advantages to customers seeking optimal performance and peace of mind. Upgrade your power management solutions today with the TPS22942DCKRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing overall manufacturing costs.

Nominal Supply Voltage (Vsup): 1.8 V

The low nominal supply voltage reduces power consumption and heat generation, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and operate reliably in industrial settings.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity and corrosion resistance, ensuring stable electrical connections over time.

Width (mm): 1.25 mm

The compact width of this product allows for high-density mounting on PCBs, optimizing space usage in electronic devices.

Minimum Supply Voltage (Vsup): 1.62 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing the product's versatility.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering during the manufacturing process, ensuring strong and durable connections.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets the stringent temperature and performance requirements of industrial environments.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density mounting on PCBs, increasing design flexibility and miniaturization of electronic devices.

Technical Specifications

Power Management ICs TPS22942DCKRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.62 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.25 mm

Trade Compliance

TPS22942DCKRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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