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TPS2231PWRG4

Texas Instruments

TPS2231PWRG4 by Texas Instruments

TPS2231PWRG4 by Texas Instruments is a Power Management IC with 20 terminals, operating at -40 to 85°C. It supports supply voltages of 1.5V and 3.3V, ideal for industrial applications requiring a compact design with a small outline package style. The IC features dual terminal position, nickel/palladium/gold finish, and peak reflow temperature of 260°C.

Median Price

$1.060

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 2,000 parts In-Stock

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$1.060

2,000

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$1.060

Distributors (In-Stock)

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Vyrian

USA . 5,296 parts In-Stock

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5,296

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Digiode

USA . 3,165 parts In-Stock

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3,165

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Distributors (Availability)

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One Stop Electronics

USA . 871 parts In-Stock

1+ parts

$1.500

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871

$1.500

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Semicontronic

India . 1,062 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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-

1,062

$3.500

$3.412

$3.395

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AZTECH Wire

Italy . 385 parts In-Stock

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$15.360

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385

$15.360

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Parana Technologies

USA . 1,699 parts In-Stock

1+ parts

$17.946

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$18.111

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1,699

$17.946

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$18.111

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DigiPath Technology Company

USA . 2,308 parts In-Stock

1+ parts

$19.761

100+ parts

$18.180

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2,308

$19.761

$18.180

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ChromeModa Solutions

Germany . 4,478 parts In-Stock

1+ parts

$20.164

100+ parts

$16.534

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4,478

$20.164

$16.534

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IDEA Electronic Components Group

UK . 381 parts In-Stock

1+ parts

$20.164

100+ parts

$19.156

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$18.148

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381

$20.164

$19.156

$18.148

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A-Z Elektronik GmbH

Germany . 3,774 parts In-Stock

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Kepictronics

USA . 3,157 parts In-Stock

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Corphita

USA . 3,012 parts In-Stock

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Microchip USA

USA . 2,872 parts In-Stock

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Corohmni

South Africa . 149 parts In-Stock

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Overview

Discover the innovative TPS2231PWRG4 by Texas Instruments, a cutting-edge Power Management IC that offers unparalleled quality and reliability. With Texas Instruments' renowned expertise in manufacturing, this product ensures top-notch performance and durability. Ideal for a wide range of applications, this Power Management IC guarantees efficient power supply support for your electronic devices. Experience the value and benefits of this product with its compact design, versatile features, and high-grade materials. Upgrade your systems with the TPS2231PWRG4 and enjoy seamless power management like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and heat resistance, making this product suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a standard supply voltage of 3.3V ensures compatibility with common power sources and other components in the system.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting to external devices and enables the IC to support multiple functions efficiently.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand harsh environmental conditions without compromising performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish ensures good conductivity and reliability in connecting the IC to external components.

Width (mm): 4.4 mm

The compact width of 4.4mm makes this IC suitable for space-constrained applications where size is a critical factor.

Minimum Supply Voltage (Vsup): 3 V

Supporting a minimum supply voltage of 3V allows for operation even in low-power scenarios, ensuring continuous functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade environments, this IC can handle demanding temperature conditions and maintain stable performance.

Technical Specifications

Power Management ICs TPS2231PWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.15 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.35,3V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

TPS2231PWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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