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TPS2231MRGPR-1

Texas Instruments

TPS2231MRGPR-1 by Texas Instruments

TPS2231MRGPR-1 by Texas Instruments is a Power Management IC with 20 terminals, operating at -40 to 85°C. It supports supply voltages of 1.5V and 3.3V, ideal for industrial applications requiring a compact chip carrier package with a low profile design. With surface mount capability and nickel palladium gold finish, it ensures reliable power supply support in various electronic systems.

Median Price

$1.414

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 108,000 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

$1.150

10k+ parts

$1.030

108,000

-

$1.390

$1.150

$1.030

Verical

USA . 108,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.438

10k+ parts

$1.288

108,000

-

-

$1.438

$1.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,090 parts In-Stock

1+ parts

$1.083

100+ parts

-

1k+ parts

-

10k+ parts

-

3,090

$1.083

-

-

-

Vyrian

USA . 6,603 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,603

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 107,794 parts In-Stock

1+ parts

$0.970

100+ parts

-

1k+ parts

-

10k+ parts

-

107,794

$0.970

-

-

-

Semicontronic

India . 107,779 parts In-Stock

1+ parts

$0.970

100+ parts

$0.946

1k+ parts

$0.941

10k+ parts

-

107,779

$0.970

$0.946

$0.941

-

Corphita

USA . 2,158 parts In-Stock

1+ parts

$1.026

100+ parts

-

1k+ parts

-

10k+ parts

-

2,158

$1.026

-

-

-

Corohmni

South Africa . 263 parts In-Stock

1+ parts

$1.140

100+ parts

-

1k+ parts

-

10k+ parts

-

263

$1.140

-

-

-

Parana Technologies

USA . 92 parts In-Stock

1+ parts

$11.631

100+ parts

-

1k+ parts

$12.026

10k+ parts

-

92

$11.631

-

$12.026

-

IDEA Electronic Components Group

UK . 1,648 parts In-Stock

1+ parts

$13.068

100+ parts

$12.415

1k+ parts

$11.761

10k+ parts

-

1,648

$13.068

$12.415

$11.761

-

ChromeModa Solutions

Germany . 270 parts In-Stock

1+ parts

$13.068

100+ parts

$10.716

1k+ parts

-

10k+ parts

-

270

$13.068

$10.716

-

-

A-Z Elektronik GmbH

Germany . 7,743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,743

-

-

-

-

Kepictronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

-

-

-

DigiPath Technology Company

USA . 1,860 parts In-Stock

1+ parts

-

100+ parts

$11.782

1k+ parts

-

10k+ parts

-

1,860

-

$11.782

-

-

ChipstoGo Electronic ltd

UK . 866 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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866

-

-

-

-

Microchip USA

USA . 343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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343

-

-

-

-

Overview

Experience the superior quality and reliability of Texas Instruments with the TPS2231MRGPR-1 Power Management IC. Designed for a wide range of applications, this chip carrier package offers advanced power supply support circuitry ideal for industrial environments. With a nominal supply voltage of 3.3V and a maximum operating temperature of 85°C, this innovative solution provides customers with unmatched value, efficiency, and performance. Trust Texas Instruments to deliver cutting-edge technology that meets your power management needs with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the internal components of the Power Management IC, ensuring a longer lifespan.

Nominal Supply Voltage (Vsup): 3.3 V

Having a stable nominal supply voltage of 3.3V ensures consistent power delivery to the connected devices, reducing the risk of voltage fluctuations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this Power Management IC can withstand elevated temperatures without impacting its performance, making it suitable for industrial applications.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 means this Power Management IC is less susceptible to moisture damage during handling and storage, increasing its reliability.

Technical Specifications

Power Management ICs TPS2231MRGPR-1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

TPS2231MRGPR-1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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