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TPS2223ADBG4

Texas Instruments

TPS2223ADBG4 by Texas Instruments

TPS2223ADBG4 by Texas Instruments is a Power Management IC with 24 terminals, operating at temperatures from -40 to 85°C. It supports supply voltages of 3.3V and 5V, making it ideal for industrial applications requiring power supply support circuits. The package style is small outline with shrink pitch, suitable for surface mount assembly.

Median Price

$3.858

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 124 parts In-Stock

1+ parts

-

100+ parts

$3.430

1k+ parts

$3.070

10k+ parts

$2.890

124

-

$3.430

$3.070

$2.890

Verical

USA . 124 parts In-Stock

1+ parts

-

100+ parts

$4.287

1k+ parts

$3.837

10k+ parts

$3.612

124

-

$4.287

$3.837

$3.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,798 parts In-Stock

1+ parts

$3.192

100+ parts

-

1k+ parts

-

10k+ parts

-

1,798

$3.192

-

-

-

Vyrian

USA . 2,921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,921

-

-

-

-

DigiKey Marketplace

USA . 124 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

124

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 124 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

-

10k+ parts

-

124

$2.860

-

-

-

Corphita

USA . 3,801 parts In-Stock

1+ parts

$3.024

100+ parts

-

1k+ parts

-

10k+ parts

-

3,801

$3.024

-

-

-

Parana Technologies

USA . 1,526 parts In-Stock

1+ parts

$16.560

100+ parts

-

1k+ parts

$16.838

10k+ parts

-

1,526

$16.560

-

$16.838

-

DigiPath Technology Company

USA . 2,225 parts In-Stock

1+ parts

$18.235

100+ parts

$16.776

1k+ parts

-

10k+ parts

-

2,225

$18.235

$16.776

-

-

IDEA Electronic Components Group

UK . 2,034 parts In-Stock

1+ parts

$18.607

100+ parts

$17.677

1k+ parts

$16.746

10k+ parts

-

2,034

$18.607

$17.677

$16.746

-

ChromeModa Solutions

Germany . 277 parts In-Stock

1+ parts

$18.607

100+ parts

$15.258

1k+ parts

-

10k+ parts

-

277

$18.607

$15.258

-

-

Microchip USA

USA . 1,822 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,822

-

-

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Overview

Experience unparalleled power management with the TPS2223ADBG4 by Texas Instruments. Crafted with precision and expertise, this power management IC offers seamless integration into a variety of applications. From industrial to consumer electronics, this small outline, shrink pitch package delivers top-notch performance with a nominal supply voltage of 3.3V. With its nickel/palladium/gold terminal finish and dual position terminals, this product ensures reliability and efficiency in every use. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the components inside the package, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy mounting on circuit boards, saving space and making the product suitable for compact designs.

Nominal Supply Voltage (Vsup): 3.3 V

Having a fixed nominal supply voltage of 3.3V simplifies design requirements and ensures compatibility with standard power sources.

No. of Terminals: 24

With a high number of terminals, this power management IC provides versatility in connectivity options for various external components.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance even in demanding industrial environments.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high-speed operation with low power consumption.

Technical Specifications

Power Management ICs TPS2223ADBG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET; BREAK-BEFORE-MAKE SWITCHING

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

5.3 mm

Trade Compliance

TPS2223ADBG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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