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TPS2113PWRG4

Texas Instruments

TPS2113PWRG4 by Texas Instruments

TPS2113PWRG4 by Texas Instruments is a Power Management IC with 2.8V nominal voltage, 1.5-5.5V supply range, and 0.09mA max current. It has dual channels for power supply support circuits in industrial applications, featuring a small outline package with gull wing terminals suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,758 parts In-Stock

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6,758

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Digiode

USA . 3,223 parts In-Stock

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3,223

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Parana Technologies

USA . 1,078 parts In-Stock

1+ parts

$2.776

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$3.261

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1,078

$2.776

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$3.261

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DigiPath Technology Company

USA . 1,928 parts In-Stock

1+ parts

$3.057

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$2.812

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1,928

$3.057

$2.812

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ChromeModa Solutions

Germany . 2,135 parts In-Stock

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$3.119

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$2.558

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2,135

$3.119

$2.558

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IDEA Electronic Components Group

UK . 1,604 parts In-Stock

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$3.119

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$2.807

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1,604

$3.119

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$2.807

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One Stop Electronics

USA . 701 parts In-Stock

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$5.500

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701

$5.500

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Ampacity Inc.

Singapore . 682 parts In-Stock

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$5.500

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682

$5.500

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Corohmni

South Africa . 286 parts In-Stock

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$7.370

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286

$7.370

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AZTECH Wire

Italy . 733 parts In-Stock

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$18.974

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Argo Parts USA

USA . 5,369 parts In-Stock

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Kepictronics

USA . 5,200 parts In-Stock

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Corphita

USA . 4,226 parts In-Stock

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Continental Prestige Electronics

USA . 1,847 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Microchip USA

USA . 320 parts In-Stock

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320

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Power up your projects with the TPS2113PWRG4 from Texas Instruments, a leading manufacturer in the industry of Power Management ICs. This versatile device offers a wide range of applications in power supply support circuits, providing reliable and efficient performance. With its compact design and adjustable threshold feature, this IC is perfect for industrial-grade projects that require precision and high-quality power management. Trust Texas Instruments to deliver superior products that meet your needs and exceed your expectations. Choose the TPS2113PWRG4 for unmatched value and performance in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable applications.

Surface Mount: YES

This design allows for easy and efficient installation on circuit boards, saving time and space.

Nominal Supply Voltage (Vsup): 2.8 V

The nominal supply voltage of 2.8V ensures stable and reliable power distribution throughout the system.

Power Supplies (V): 1.8/5

This product supports multiple power supplies, providing flexibility for different voltage requirements in a single device.

No. of Terminals: 8

With 8 terminals, this power management IC offers ample connectivity options for various components in a circuit.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the IC can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for reliable performance in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Width (mm): 3 mm

The compact width of 3mm saves space on the circuit board, making this IC suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 1.5 V

The minimum supply voltage of 1.5V ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, making it easy to integrate into manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure soldering connections during assembly.

Temperature Grade: INDUSTRIAL

The industrial temperature grade of this IC makes it suitable for rugged industrial applications with harsh operating conditions.

Maximum Supply Current (Isup): 0.09 mA

The low maximum supply current of 0.09mA helps minimize power consumption and heat generation in the system.

No. of Channels: 2

With 2 channels, this power management IC can handle multiple power inputs or outputs simultaneously.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and easy soldering during installation.

Terminal Pitch: 0.65 mm

The narrow terminal pitch of 0.65mm allows for high-density mounting on the PCB, saving valuable board space.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V accommodates a wide range of power sources for compatibility with various systems.

Adjustable Threshold: YES

The ability to adjust the threshold ensures precise control over voltage levels, catering to different system requirements effectively.

Technical Specifications

Power Management ICs TPS2113PWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

CAN SWITCH A VOLTAGE AS LOW AS 1.5V AS LONG AS THERE IS A MIN OF 2.8V AT ONE OF THE I/P POWER PINS

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.09 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS2113PWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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