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TPS2112PWRG4

Texas Instruments

TPS2112PWRG4 by Texas Instruments

TPS2112PWRG4 by Texas Instruments is a Power Management IC with 8 terminals, operating at -40 to 85 °C. It supports power supplies of 1.8/5V and has a max supply current of 0.09mA. Ideal for industrial applications requiring dual channel power supply support circuits in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,146 parts In-Stock

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Digiode

USA . 4,724 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,137 parts In-Stock

1+ parts

$0.500

100+ parts

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1,137

$0.500

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One Stop Electronics

USA . 1,543 parts In-Stock

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$1.500

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1,543

$1.500

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Parana Technologies

USA . 1,209 parts In-Stock

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$2.162

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$2.675

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1,209

$2.162

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$2.675

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DigiPath Technology Company

USA . 1,056 parts In-Stock

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$2.380

100+ parts

$2.190

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1,056

$2.380

$2.190

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ChromeModa Solutions

Germany . 1,095 parts In-Stock

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$2.429

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$1.992

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1,095

$2.429

$1.992

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IDEA Electronic Components Group

UK . 499 parts In-Stock

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$2.429

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$2.186

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499

$2.429

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$2.186

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Semicontronic

India . 347 parts In-Stock

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$6.500

100+ parts

$6.338

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$6.305

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347

$6.500

$6.338

$6.305

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AZTECH Wire

Italy . 414 parts In-Stock

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$17.683

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$17.683

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Corphita

USA . 4,736 parts In-Stock

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Microchip USA

USA . 1,273 parts In-Stock

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iodParts Technologies Inc.

India . 995 parts In-Stock

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995

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Corohmni

South Africa . 302 parts In-Stock

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Overview

Enhance your power management capabilities with the TPS2112PWRG4 by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product boasts a compact package design and adjustable threshold for maximum flexibility. Experience seamless operation and efficient power supply support with Texas Instruments' TPS2112PWRG4, providing you with the value and benefits you need to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the product.

Surface Mount: YES

Facilitates easy installation on PCBs, saving space and enabling automated assembly.

Nominal Supply Voltage (Vsup): 2.8 V

Optimal supply voltage for efficient power management.

No. of Terminals: 8

Sufficient number of terminals for connectivity and functionality.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial use.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures, enhancing versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-term performance.

Width (mm): 3 mm

Compact width size for space-constrained applications.

Minimum Supply Voltage (Vsup): 1.5 V

Supports a low minimum supply voltage, ensuring compatibility with various systems.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements for reliable operation in harsh environments.

Maximum Supply Current (Isup): 0.09 mA

Low supply current consumption for energy-efficient operation.

No. of Channels: 2

Dual channels offer versatility for multiple power management applications.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a high maximum supply voltage for flexibility in power input.

Adjustable Threshold: YES

Allows for customizable threshold settings for precise power management control.

Technical Specifications

Power Management ICs TPS2112PWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

CAN SWITCH A VOLTAGE AS LOW AS 1.5V AS LONG AS THERE IS A MIN OF 2.8V AT ONE OF THE I/P POWER PINS

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.09 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS2112PWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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