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TPS2064DGNG4

Texas Instruments

TPS2064DGNG4 by Texas Instruments

TPS2064DGNG4 by Texas Instruments is a Power Management IC with 8 terminals, operating at 3.3V. It features a small outline package style and can handle temperatures from 0 to 70°C. Ideal for power supply support circuits in commercial-grade applications.

Median Price

$1.320

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 40 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.180

10k+ parts

$1.110

40

-

$1.320

$1.180

$1.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,724 parts In-Stock

1+ parts

$1.358

100+ parts

-

1k+ parts

-

10k+ parts

-

4,724

$1.358

-

-

-

Vyrian

USA . 8,085 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,085

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 40 parts In-Stock

1+ parts

$1.220

100+ parts

-

1k+ parts

-

10k+ parts

-

40

$1.220

-

-

-

Semicontronic

India . 40 parts In-Stock

1+ parts

$1.220

100+ parts

$1.190

1k+ parts

$1.183

10k+ parts

-

40

$1.220

$1.190

$1.183

-

Corphita

USA . 1,673 parts In-Stock

1+ parts

$1.287

100+ parts

-

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-

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-

1,673

$1.287

-

-

-

Corohmni

South Africa . 235 parts In-Stock

1+ parts

$1.430

100+ parts

-

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10k+ parts

-

235

$1.430

-

-

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Parana Technologies

USA . 2,130 parts In-Stock

1+ parts

$12.842

100+ parts

-

1k+ parts

$13.317

10k+ parts

-

2,130

$12.842

-

$13.317

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DigiPath Technology Company

USA . 1,744 parts In-Stock

1+ parts

$14.140

100+ parts

$13.009

1k+ parts

-

10k+ parts

-

1,744

$14.140

$13.009

-

-

ChromeModa Solutions

Germany . 3,764 parts In-Stock

1+ parts

$14.429

100+ parts

$11.832

1k+ parts

-

10k+ parts

-

3,764

$14.429

$11.832

-

-

IDEA Electronic Components Group

UK . 561 parts In-Stock

1+ parts

$14.429

100+ parts

$13.708

1k+ parts

$12.986

10k+ parts

-

561

$14.429

$13.708

$12.986

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AZTECH Wire

Italy . 600 parts In-Stock

1+ parts

$14.490

100+ parts

-

1k+ parts

-

10k+ parts

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600

$14.490

-

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Microchip USA

USA . 2,593 parts In-Stock

1+ parts

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2,593

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Kepictronics

USA . 1,365 parts In-Stock

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1,365

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Overview

Upgrade your power management with the TPS2064DGNG4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality Power Management ICs that are essential for a wide range of applications. With a small outline, heat sink profile, and dual terminal position, this IC provides reliable performance in commercial-grade environments. Ensure efficient power supply support with its low supply voltage and minimal seated height, all while benefiting from Texas Instruments' reputation for excellence. Experience the value and advantages this product offers to meet your power management needs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and insulation for the internal components, ensuring reliable performance over time.

Surface Mount: YES

Allows for easy and efficient installation on a circuit board, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with a wide range of devices and power sources, making it versatile for various applications.

No. of Terminals: 8

Provides sufficient connectivity options for the device to interface with other components in the circuit.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even in high-temperature environments, making it suitable for a variety of applications.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

Enhances conductivity and corrosion resistance, ensuring stable electrical connections for optimal performance.

Width (mm): 3 mm

Compact size allows for easy integration into space-constrained designs, making it ideal for portable and compact devices.

No. of Channels: 2

Provides flexibility in managing power distribution to multiple components, enhancing the device's overall efficiency.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a wide range of power sources and devices, making it versatile for different applications.

Technical Specifications

Power Management ICs TPS2064DGNG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

.09 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS2064DGNG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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