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TPS2056DR

Texas Instruments

TPS2056DR by Texas Instruments

TPS2056DR by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and temperature range of -40°C to 85°C. It is used in industrial applications for power supply support circuits due to its small outline package and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,884 parts In-Stock

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3,884

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Vyrian

USA . 2,195 parts In-Stock

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2,195

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,578 parts In-Stock

1+ parts

$0.500

100+ parts

-

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1,578

$0.500

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Semicontronic

India . 381 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

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381

$2.500

$2.438

$2.425

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One Stop Electronics

USA . 1,201 parts In-Stock

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$3.500

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1,201

$3.500

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AZTECH Wire

Italy . 242 parts In-Stock

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$14.776

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242

$14.776

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Parana Technologies

USA . 675 parts In-Stock

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$16.317

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$16.623

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675

$16.317

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$16.623

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IDEA Electronic Components Group

UK . 2,305 parts In-Stock

1+ parts

$18.334

100+ parts

$17.417

1k+ parts

$16.501

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2,305

$18.334

$17.417

$16.501

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ChromeModa Solutions

Germany . 478 parts In-Stock

1+ parts

$18.334

100+ parts

$15.034

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478

$18.334

$15.034

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Component Stockers USA

USA . 585 parts In-Stock

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$99.990

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585

$99.990

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Corphita

USA . 4,737 parts In-Stock

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4,737

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A-Z Elektronik GmbH

Germany . 1,659 parts In-Stock

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1,659

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DigiPath Technology Company

USA . 1,151 parts In-Stock

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$16.530

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1,151

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$16.530

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Microchip USA

USA . 418 parts In-Stock

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418

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Corohmni

South Africa . 323 parts In-Stock

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323

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Overview

Enhance your power management capabilities with the TPS2056DR by Texas Instruments. Manufactured with the highest quality materials and cutting-edge technology, this Power Management IC offers unparalleled reliability and efficiency. Perfect for a wide range of applications, this product provides seamless power supply support with its dual-channel design. Experience the value and benefits that come with using Texas Instruments products, and take your projects to the next level with the TPS2056DR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage (Vsup): 3.3 V

3.3V supply voltage is commonly used in many electronic devices, ensuring compatibility with a wide range of applications.

No. of Terminals: 8

8 terminals provide flexibility in connecting to other components, offering more functionality and customization options.

Maximum Operating Temperature: 85 °C

Operating at a high temperature of 85°C ensures performance and reliability even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the product can withstand extreme cold conditions without compromising functionality.

No. of Channels: 2

Having 2 channels allows for simultaneous power management and support for multiple functions or devices, enhancing overall efficiency.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, the product can handle higher power requirements, making it versatile and adaptable to various power sources.

Technical Specifications

Power Management ICs TPS2056DR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TPS2056DR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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